In this paper, we discuss emerging nanolithography technologies including double/multiple patterning, extreme ultra-violet lithography, electron-beam lithography, and their interactions with VLSI CAD. These technologies all have different manufacturing processes with their own challenges/issues. Meanwhile, nanometer VLSI designs and mask synthesis have to be co-optimized with these process technologies to ensure high product quality (performance/power/area, etc.), yield, and throughput to make future scaling worthwhile. Some recent results will be presented to show the enablement and effectiveness of such design and process integration.