2nd generation embedded DRAM with 4X lower self refresh power in 22nm Tri-Gate CMOS technology | IEEE Conference Publication | IEEE Xplore

2nd generation embedded DRAM with 4X lower self refresh power in 22nm Tri-Gate CMOS technology


Abstract:

2nd generation 1Gbit 2GHz Embedded DRAM (eDRAM) with 4X lower self refresh power compared to prior generation is developed in 22nm Tri-Gate CMOS technology. Retention tim...Show More

Abstract:

2nd generation 1Gbit 2GHz Embedded DRAM (eDRAM) with 4X lower self refresh power compared to prior generation is developed in 22nm Tri-Gate CMOS technology. Retention time has been improved by 3X (300us@95°C) by process and design optimizations. Source synchronous clocking is integrated in the design to reduce clock power without penalizing bandwidth. Charge pump power is reduced by 4X by employing comparator based regulation. Temperature controlled refresh enables minimum refresh power at all temperature conditions.
Date of Conference: 10-13 June 2014
Date Added to IEEE Xplore: 21 July 2014
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Conference Location: Honolulu, HI, USA

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