Abstract:
Thermal phenomena occurring along test execution at the final stages of the manufacturing flow are considered as a significant issue for several reasons, including dramat...Show MoreMetadata
Abstract:
Thermal phenomena occurring along test execution at the final stages of the manufacturing flow are considered as a significant issue for several reasons, including dramatic effects like circuit damage that is leading to yield loss. This paper tries to redeem those bad guys in order to exploit them to improve the test quality, reducing the overall test cost without affecting the yield.
Published in: 2016 IEEE 34th VLSI Test Symposium (VTS)
Date of Conference: 25-27 April 2016
Date Added to IEEE Xplore: 26 May 2016
ISBN Information:
Electronic ISSN: 2375-1053