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GLSVLSI '07: Proceedings of the 17th ACM Great Lakes symposium on VLSI
ACM2007 Proceeding
Publisher:
  • Association for Computing Machinery
  • New York
  • NY
  • United States
Conference:
GLSVLSI07: Great Lakes Symposium on VLSI 2007 Stresa-Lago Maggiore Italy March 11 - 13, 2007
ISBN:
978-1-59593-605-9
Published:
11 March 2007
Sponsors:
Next Conference
June 12 - 14, 2024
Clearwater , FL , USA
Bibliometrics
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Abstract

Welcome to the 17th edition of the Great Lakes Symposium on VLSI (GLSVLSI), the first one held outside of USA and at the beautiful Stresa-Lago Maggiore of Italy. Since its first meeting in March 1991 at Kalamazoo, Michigan, GLSVLSI has traveled beyond the Great Lakes and become an international conference with submissions from all over the world. It has emerged as a premier conference for publishing innovations in VLSI.This year, a record number of 324 papers were submitted, of which 68 papers (a 21% acceptance rate) were accepted for oral presentation at the symposium. With poster papers, a total of 114 papers will be presented at the symposium and published in the proceedings. The final technical program consists of 34 full presentations and 34 short ones in 17 oral sessions and 46 posters in 2 poster sessions.Congratulations to Michalis Galanis and Costas Goutis for winning the GLSVLSI 2007 Best Student Paper Award. Their paper "Improving Performance and Energy Consumption in Embedded Microprocessor Platforms with a Flexible Custom Coprocessor Data-path" will be one of the first presentations in the symposium. They will also receive the prize on Monday's dinner banquet.This year's tutorial is on "Thermal modeling and thermal-aware design in nanometer technologies" and is organized by Prof. Mircea Stan of University of Virginia.We are also looking forward to the six keynote speeches that will be delivered by Georges Gielen (Katholieke Universiteit, Leuven), Kiyoo Itoh (Hitachi), Philippe Magarshack (STMicroelectronics), Giovanni De Micheli (EPFL), Massoud Pedram (University of Southern California), Sachin Sapatnekar (University of Minnesota), and an embedded tutorial by Jamil Kawa and Charles Chiang (Synopsys, Inc).

Article
Design challenges in 45nm and below: DFM, low-power and design for reliability

Designing in 45nm allows another doubling in transistor density vs 65nm, both for logic gates and for SRAM cells. However, Lithography implications are such that Design rules have to be augmented with recommended rules and regular design, and verified ...

Article
Sleep transistor distribution in row-based MTCMOS designs

The Multi-Threshold CMOS (MTCMOS) technology has become a popular technique for standby power reduction. This technology utilizes high-Vth sleep transistors to reduce sub threshold leakage currents during the standby mode of CMOS VLSI Circuits. The ...

Article
Multi-processor operating system emulation framework with thermal feedback for systems-on-chip

Multi-Processor System-On-Chip (MPSoC) can provide the performance levels required by high-end embedded applications. However, they do so at the price of an increasing power density, which may lead to thermal runaway if coupled with low-cost packaging ...

Article
Computer-aided design of 3d integrated circuits

Unlike conventional electronic circuits, where transistors are placed in a single plane, three-dimensional (3D) integrated circuits utilize multiple tiers of active devices, placed one above another. Recent advances in processing technologies have ...

Article
Low-voltage limitations of deep-sub-100-nm CMOS LSIs: view of memory designers

Deep-sub-100-nm CMOS LSIs using a bulk CMOS device and a planar double-gate FD-SOI device are compared in terms of the low-voltage limitation of RAM cells, sense amplifiers, and logic gates. The limitation strongly depends on the ever-larger VT ...

Article
Future trends for wireless communication frontends in nanometer CMOS

CMOS technology is evolving deeper and deeper into the nanometer era, with designs now being done in 90nm and even 65nm. This makes the integration of entire systems possible, many of which are mixed-signal in nature, including analog and/or RF parts. ...

Contributors
  • Northwestern University
  • Polytechnic of Turin
  • King Abdullah University of Science and Technology

Recommendations

Acceptance Rates

Overall Acceptance Rate312of1,156submissions,27%
YearSubmittedAcceptedRate
GLSVLSI '181974824%
GLSVLSI '171974824%
GLSVLSI '161975025%
GLSVLSI '151484128%
GLSVLSI '141794927%
GLSVLSI '132387632%
Overall1,15631227%