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Sustainable multi-core architecture with on-chip wireless links

Published:03 May 2012Publication History

ABSTRACT

Current commercial systems on chip (SoC) designs integrate an increasingly large number of pre-designed cores and their number is predicted to increase significantly in the near future. Specifically, molecular-scale computing will allow single or even multiple order-of-magnitude improvements in device densities. In the design of high-performance massive multi-core chips, power and temperature have become dominant constraints. Increased power consumption can raise chip temperature,which in turn can decrease chip reliability and performance and increase cooling costs.The new, ensuing possibilities in terms of single chip integration call for new paradigms, architectures, and infrastructures for high bandwidth and low-power interconnects. In this paper we demonstrate how small-world Network-on-Chip (NoC) architectures with long-range wireless links enable design of energy and thermally efficient sustainable multi-core platforms.

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      cover image ACM Conferences
      GLSVLSI '12: Proceedings of the great lakes symposium on VLSI
      May 2012
      388 pages
      ISBN:9781450312448
      DOI:10.1145/2206781

      Copyright © 2012 ACM

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      Publication History

      • Published: 3 May 2012

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