Ming Fan
Abstract
With exponentially increased transistor density on multi-core platforms, the power explosion and consequently soaring chip temperature have become critical challenges for system designers. Moreover, the increasing chip temperature results in higher leakage power, hence further aggravates the increment of the overall power consumption [1]. Thus, the dramatically growing power/energy consumption and chip temperature severely affect the cost, reliability and performance of the systems [4].
- V. Chaturvedi and G. Quan. Leakage conscious dvs scheduling for peak temperature minimization. In Asia and South Pacific Design Automation Conference (ASP-DAC), pages 135--140, Jan. 2011. Google Scholar
Digital Library
- G. Quan and Y. Zhang. Leakage aware feasibility analysis for temperature-constrained hard real-time periodic tasks. In Real-Time Systems, 2009. ECRTS '09. 21st Euromicro Conference on, pages 207--216, Jul. 2009. Google ScholarDigital Library
- S. Sharifi, R. Ayoub, and T. Rosing. Tempomp: Integrated prediction and management of temperature in heterogeneous mpsocs. In Design, Automation Test in Europe Conference Exhibition (DATE), pages 593--598, Mar. 2012. Google ScholarDigital Library
- K. Skadron, M. Stan, W. Huang, S. Velusamy, K. Sankaranarayanan, and D. Tarjan. Temperature-aware microarchitecture. In Computer Architecture, 2003. Proceedings. 30th Annual International Symposium on, pages 2--13, june 2003. Google ScholarDigital Library
- I. Ukhov, M. Bao, P. Eles, and Z. Peng. Steady-state dynamic temperature analysis and reliability optimization for embedded multiprocessor systems. In Design Automation Conference (DAC), Jun. 2012. Google ScholarDigital Library
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