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Reducing cross-coupling among interconnect wires in deep-submicron datapath design

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Published:01 June 1999Publication History
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References

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  1. Reducing cross-coupling among interconnect wires in deep-submicron datapath design

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        cover image ACM Conferences
        DAC '99: Proceedings of the 36th annual ACM/IEEE Design Automation Conference
        June 1999
        1000 pages
        ISBN:1581131097
        DOI:10.1145/309847

        Copyright © 1999 ACM

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        • Published: 1 June 1999

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