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Thermal covert channel in bluetooth low energy networks

Published:15 May 2019Publication History

ABSTRACT

This paper investigates thermal covert channels in the context of the Internet-of-Things. More, precisely we demonstrate such a channel on BLE-enabled devices. We explain how the core design principles of BLE link-layer protocol, combined with well-timed intensive CPU calculations can be leveraged to mount a thermal covert channel between two devices.

We implement the attack on three different hardware architectures, a Raspberry Pi 3B, a Motorola X 2014 and an iPhone 5s, and analyze the performance of the channel. We show that we have a similar throughput as previous comparable work, but we greatly improve the range of the channel.

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    • Published in

      cover image ACM Conferences
      WiSec '19: Proceedings of the 12th Conference on Security and Privacy in Wireless and Mobile Networks
      May 2019
      359 pages
      ISBN:9781450367264
      DOI:10.1145/3317549

      Copyright © 2019 ACM

      © 2019 Association for Computing Machinery. ACM acknowledges that this contribution was authored or co-authored by an employee, contractor or affiliate of a national government. As such, the Government retains a nonexclusive, royalty-free right to publish or reproduce this article, or to allow others to do so, for Government purposes only.

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      New York, NY, United States

      Publication History

      • Published: 15 May 2019

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