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Title: ARIC 2019 workshop report: The 2nd ACM SIGSPATIAL International Workshop on Advances in Resilient and Intelligent Cities: Chicago, IL, USA November 5, 2019

Abstract

The advancements in sensor technology and ubiquity of connected devices has enabled the generation of large volume of disparate, dynamic and geographically distributed data both by scientific communities and citizens. With astonishing technological innovations and convergence, there have been major changes in peoples daily activities and social interaction. The socio-technological innovations motivate the concept of smart and connected cities. A smart city, however, is subjected to the same challenges as a conventional city, such as environmental damages, hazard impacts, access to services and resources, due to continuous population and economic growth. Therefore, it is imperative to improve our understanding of Resilient and Intelligent Cities in order to leverage technologies and artificial intelligence to tackle the challenges cities face, which range from climate change, public health, traffic congestion, economic growth, to digital divide, social equity, political movements, and cultural conflicts, among others.

Authors:
ORCiD logo [1]; ORCiD logo [1]
  1. ORNL
Publication Date:
Research Org.:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1669748
DOE Contract Number:  
AC05-00OR22725
Resource Type:
Conference
Resource Relation:
Journal Volume: 11; Journal Issue: 3; Conference: The 2nd ACM SIGSPATIAL International Workshop on Advances in Resilient and Intelligent Cities - Chicago, Illinois, United States of America - 11/5/2019 5:00:00 AM-
Country of Publication:
United States
Language:
English

Citation Formats

Kar, Bandana, and Omitaomu, Femi. ARIC 2019 workshop report: The 2nd ACM SIGSPATIAL International Workshop on Advances in Resilient and Intelligent Cities: Chicago, IL, USA November 5, 2019. United States: N. p., 2020. Web. doi:10.1145/3383653.3383660.
Kar, Bandana, & Omitaomu, Femi. ARIC 2019 workshop report: The 2nd ACM SIGSPATIAL International Workshop on Advances in Resilient and Intelligent Cities: Chicago, IL, USA November 5, 2019. United States. https://doi.org/10.1145/3383653.3383660
Kar, Bandana, and Omitaomu, Femi. 2020. "ARIC 2019 workshop report: The 2nd ACM SIGSPATIAL International Workshop on Advances in Resilient and Intelligent Cities: Chicago, IL, USA November 5, 2019". United States. https://doi.org/10.1145/3383653.3383660. https://www.osti.gov/servlets/purl/1669748.
@article{osti_1669748,
title = {ARIC 2019 workshop report: The 2nd ACM SIGSPATIAL International Workshop on Advances in Resilient and Intelligent Cities: Chicago, IL, USA November 5, 2019},
author = {Kar, Bandana and Omitaomu, Femi},
abstractNote = {The advancements in sensor technology and ubiquity of connected devices has enabled the generation of large volume of disparate, dynamic and geographically distributed data both by scientific communities and citizens. With astonishing technological innovations and convergence, there have been major changes in peoples daily activities and social interaction. The socio-technological innovations motivate the concept of smart and connected cities. A smart city, however, is subjected to the same challenges as a conventional city, such as environmental damages, hazard impacts, access to services and resources, due to continuous population and economic growth. Therefore, it is imperative to improve our understanding of Resilient and Intelligent Cities in order to leverage technologies and artificial intelligence to tackle the challenges cities face, which range from climate change, public health, traffic congestion, economic growth, to digital divide, social equity, political movements, and cultural conflicts, among others.},
doi = {10.1145/3383653.3383660},
url = {https://www.osti.gov/biblio/1669748}, journal = {},
issn = {1946-7729},
number = 3,
volume = 11,
place = {United States},
year = {Sat Feb 01 00:00:00 EST 2020},
month = {Sat Feb 01 00:00:00 EST 2020}
}

Conference:
Other availability
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