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ISPD 2021 Wafer-Scale Physics Modeling Contest: A New Frontier for Partitioning, Placement and Routing

Published:21 March 2021Publication History

ABSTRACT

Solving 3-D partial differential equations in a Finite Element model is computationally intensive and requires extremely high memory and communication bandwidth. This paper describes a novel way where the Finite Element mesh points of varying resolution are mapped on a large 2-D homogenous array of processors. Cerebras developed a novel supercomputer that is powered by a 21.5cm by 21.5cm Wafer-Scale Engine (WSE) with 850,000 programmable compute cores. With 2.6 trillion transistors in a 7nm process this is by far the largest chip in the world. It is structured as a regular array of 800 by 1060 identical processing elements, each with its own local fast SRAM memory and direct high bandwidth connection to its neighboring cores. For the 2021 ISPD competition we propose a challenge to optimize placement of computational physics problems to achieve the highest possible performance on the Cerebras supercomputer. The objectives are to maximize performance and accuracy by optimizing the mapping of the problem to cores in the system. This involves partitioning and placement algorithms.

References

  1. Kamil Rocki, Dirk Van Essendelft, Ilya Sharapov, Robert Schreiber, Michael Morrison, Vladimir Kibardin, Andrey Portnoy, Jean Francois Dietiker, Madhava Syamlal, Michael James, "Fast Stencil-Code Computation on a Wafer-Scale Processor", Supercomputing 2020, https://arxiv.org/pdf/2010.03660.pdfGoogle ScholarGoogle Scholar
  2. Michael James, Marvin Tom, Patrick Groeneveld, Vladimir Kibardin, "Physical Mapping of Neural Networks on a Wafer-Scale Deep Learning Accelerator", Proc International Symposium on Physical Design 2020, pp 140--145,Google ScholarGoogle Scholar
  3. M. James, P. Groeneveld, M. Tom,"ISPD 2020 Contest: Wafer Scale Deep Learning Accelerator Placement", Jan 2, 2020, Accessed on Jan 31, 2020. [online] Available: https://www.cerebras.net/ispd-2020-contest/Google ScholarGoogle Scholar

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  1. ISPD 2021 Wafer-Scale Physics Modeling Contest: A New Frontier for Partitioning, Placement and Routing

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        cover image ACM Conferences
        ISPD '21: Proceedings of the 2021 International Symposium on Physical Design
        March 2021
        159 pages
        ISBN:9781450383004
        DOI:10.1145/3439706

        Copyright © 2021 ACM

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        Association for Computing Machinery

        New York, NY, United States

        Publication History

        • Published: 21 March 2021

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        Overall Acceptance Rate62of172submissions,36%

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