Skip to main content

Non-Hysteretic Behavior of Super Steep Ferroelectric Negative Capacitance Tunnel Field Effect Transistor Based on Body Profile Engineering

Buy Article:

$107.14 + tax (Refund Policy)

In this paper we have investigated a novel device structure for non-hysteretic ferroelectric negative capacitance Tunnel FET (NC-TFET) based on the body profile engineering. The proposed device exhibits super steep sub-threshold slope (SS) due to the cumulative effect of quantum mechanical band-to-band tunneling and gate bias boosting because of the polarization in the ferroelectric material. It leads to the negative capacitance (NC) effect in the device. It has magnificently reduced hysteretic losses due to thin semiconductor on conductor (i.e., T SOC) body profile. This body profile tailors the device capacitance to achieve non-hysteretic behavior. The design of the proposed non-hysteretic NC-TFET is investigated and compared with conventional TFET having identical device dimensions and bias conditions using 2-D TCAD simulations. Owing to enhanced tunneling probability due to intrinsic bias boosting, it exhibits super steep sub-threshold slope (SS) as it is significantly reduced by 37% compared to conventional TFET at room temperature. Further, it also demonstrates significant amplification of drive current and transconductance (g m) (10× even at 0.5 V DD). Results reveal its potential for next generation high speed low power applications.

Keywords: INTRINSIC BIAS BOOSTING; NEGATIVE CAPACITANCE (NC); NON-HYSTERETIC BEHAVIOR; SUB-THRESHOLD SLOPE (SS); THIN SEMICONDUCTOR ON CONDUCTOR (I.E. TSOC)

Document Type: Research Article

Publication date: 01 December 2015

More about this publication?
  • The electronic systems that can operate with very low power are of great technological interest. The growing research activity in the field of low power electronics requires a forum for rapid dissemination of important results: Journal of Low Power Electronics (JOLPE) is that international forum which offers scientists and engineers timely, peer-reviewed research in this field.
  • Editorial Board
  • Information for Authors
  • Subscribe to this Title
  • Terms & Conditions
  • Ingenta Connect is not responsible for the content or availability of external websites
  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content