The copper nitride surface characteristics according to atmospheric pressure plasma (APP) and excimer ultraviolet (EUV) treatment were compared using XPS and AFM. As the result of XPS analysis result, in C1s, the organic material removal effect was greater for EUV treatment than for APP, and the oxygen content was found to be low. In Cu (933eV) area, the shoulder peak of Cu compound was detected, and the reduction was greater for EUV processing than for APP. In the AFM phase image which could be analyzed using the superficial viscoelasticity, the same trend was observed. On the copper nitride surface, the weak boundary O layer is formed according to the clean processing, and such phenomenon was interpreted as a factor for lowering the affinity with polymer.