Design and Fabrication of Large Scale Micro-LED Arrays and Silicon Driver for OEIC Devices

Sang-Baie SHIN; Ko-Ichiro IIJIMA; Hiroshi OKADA; Sho IWAYAMA; Akihiro WAKAHARA

doi:10.1587/transele.E95.C.898

Special Section on Fundamentals and Applications of Advanced Semiconductor Devices

Design and Fabrication of Large Scale Micro-LED Arrays and Silicon Driver for OEIC Devices

Sang-Baie SHIN, Ko-Ichiro IIJIMA, Hiroshi OKADA, Sho IWAYAMA, Akihiro WAKAHARA

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Keywords: opto-electronic integrated circuit, micro-LED, flip-chip bonding, GaN LED arrays

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2012 Volume E95.C Issue 5 Pages 898-903

DOI https://doi.org/10.1587/transele.E95.C.898

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Abstract

In this paper, we designed and fabricated large scale micro-light-emitting-diode (LED) arrays and silicon driver for single chip device for realizing as prototypes of heterogeneous optoelectronic integrated circuits (OEICs). The large scale micro-LED arrays were separated by a dry etching method from mesa structure to 16,384 pixels of 128 × 128, each with a size of 15µm in radius. Silicon driver was designed the additional bonding pad on each driving transistor for bonding with micro-LED arrays. Fabricated micro-LED arrays and driver were flip-chip bonded using anisotropic conductive adhesive.

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