Immunity Modeling of Integrated Circuits: An Industrial Case

Frédéric LAFON; François DE DARAN; Mohamed RAMDANI; Richard PERDRIAU; M'hamed DRISSI

doi:10.1587/transcom.E93.B.1723

IEICE Transactions on Communications

Online ISSN : 1745-1345
Print ISSN : 0916-8516

Special Section on Advanced Electromagnetic Compatibility Technology in Conjunction with Main Topics of EMC'09/Kyoto

Immunity Modeling of Integrated Circuits: An Industrial Case

Frédéric LAFON, François DE DARAN, Mohamed RAMDANI, Richard PERDRIAU, M'hamed DRISSI

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Keywords: immunity, integrated circuit, EMC model, ICIM, black-box modeling, spice

JOURNAL RESTRICTED ACCESS

2010 Volume E93.B Issue 7 Pages 1723-1730

DOI https://doi.org/10.1587/transcom.E93.B.1723

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Abstract

This paper introduces a new technique for electromagnetic immunity modeling of integrated circuits (ICs), compliant with industrial requirements and valid up to 3GHz. A specific modeling flow is introduced, which makes it possible to predict the conducted immunity of an IC according to a given criterion, whatever its external environment. This methodology was validated through measurements performed on several devices.

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