With exponentially increasing power densities due to technology scaling and ever increasing demand for performance, chip temperature has become an important issue that limits the performance of computer systems. Typically, it is essential to use a set of on-chip thermal sensors to monitor temperatures during the runtime. The runtime thermal measurements are then employed by dynamic thermal management techniques to manage chip performance appropriately. In this paper, we propose an inverse distance weighting method based on a dynamic Voronoi diagram for the reconstruction of full thermal characterization of integrated circuits with non-uniform thermal sensor placements. Firstly we utilize the proposed method to transform the non-uniformly spaced samples to virtual uniformly spaced data. Then we apply three classical interpolation algorithms to reconstruct the full thermal signals in the uniformly spaced samples mode. To evaluate the effectiveness of our method, we develop an experiment for reconstructing full thermal status of a 16-core processor. Experimental results show that the proposed method significantly outperforms spectral analysis techniques, and can obtain full thermal characterization with an average absolute error of 1.72% using 9 thermal sensors per core.