Integration of Silicon Nano-Photonic Devices for Telecommunications

Seiichi ITABASHI; Hidetaka NISHI; Tai TSUCHIZAWA; Toshifumi WATANABE; Hiroyuki SHINOJIMA; Rai KOU; Koji YAMADA

doi:10.1587/transele.E95.C.199

Special Section on Photonic Devices using Nanofabrication Technology and Their Applications

Integration of Silicon Nano-Photonic Devices for Telecommunications

Seiichi ITABASHI, Hidetaka NISHI, Tai TSUCHIZAWA, Toshifumi WATANABE, Hiroyuki SHINOJIMA, Rai KOU, Koji YAMADA

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Keywords: siliconphotonics, integration, nanofabrication, telecommunication

JOURNAL RESTRICTED ACCESS

2012 Volume E95.C Issue 2 Pages 199-205

DOI https://doi.org/10.1587/transele.E95.C.199

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Abstract

Monolithic integration of various kinds of optical components on a silicon wafer is the key to making silicon (Si) photonics practical technology. Applying silicon photonics to telecommunications further requires low insertion loss and polarization independence. We propose an integration concept for telecommunications based on Si and related materials and demonstrate monolithic integration of passive and dynamic functional components. This article shows the great potential of Si photonics technology for telecommunications.

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