Recovery-aware proactive TSV repair for electromigration in 3D ICs | IEEE Conference Publication | IEEE Xplore

Recovery-aware proactive TSV repair for electromigration in 3D ICs


Abstract:

Electromigration (EM) becomes a major reliability concern in three-dimensional integrated-circuits (3D ICs). To mitigate this problem, a typical solution is to use TSV re...Show More

Abstract:

Electromigration (EM) becomes a major reliability concern in three-dimensional integrated-circuits (3D ICs). To mitigate this problem, a typical solution is to use TSV redundancy in a reactive manner, maintaining the operability of a 3D chip in the presence of EM failures by detecting and replacing faulty TSVs with spares. In this work, we explore an alternative, more preferred approach to enhance the EM-related lifetime reliability of TSV grid, in which redundancy is used proactively to allow non-faulty TSVs to be temporarily deactivated. In this way, EM wear-out can be reversed by exploiting its recovery property. Applied to 3D benchmark designs, the recovery-aware proactive repair approach increases EM-related lifetime reliability (measured in mean-time-to-failure) of the entire TSV grid by up to 12X relative to the conventional reactive method, with less area overhead.
Date of Conference: 27-31 March 2017
Date Added to IEEE Xplore: 15 May 2017
ISBN Information:
Electronic ISSN: 1558-1101
Conference Location: Lausanne, Switzerland

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