Static RAM (SRAM) is one of the critical components in advanced VLSI systems whose performance, capacity, and reliability have a decisive impact on the entire system. It offers the fastest memory in the storage hierarchy of modern computer systems. By moving toward the smaller CMOS technology nodes, the back end of the line (BEoL) interconnects are also fabricated in tighter pitch size. Hence, besides the power lines, SRAM word- and bit-line (WL and BL) are also susceptible to electromigration (EM). Therefore, EM reliability of SRAM's WL and BL needs to be analyzed during design technology co-optimization (DTCO) cycle. In this work, we investigate the impact of technology scaling on SRAM designs and perform a detailed analysis on the trend of their EM reliability and energy consumption. Our analysis shows that although scaling down the CMOS technology can result in a 2.68x improvement in the energy efficiency of the SRAM module, it increases the EM-induced hydrostatic stress by 2.53x.