Abstract:
We developed compact InP-based MZM sub-assemblies with built-in electrical filters by using flip-chip bonding technique. We realized the E/O response at -3 dB of 41 GHz a...Show MoreMetadata
Abstract:
We developed compact InP-based MZM sub-assemblies with built-in electrical filters by using flip-chip bonding technique. We realized the E/O response at -3 dB of 41 GHz and EVM of 14.9% for 50 Gbaud QPSK modulation.
Date of Conference: 07-11 July 2019
Date Added to IEEE Xplore: 29 August 2019
ISBN Information:
Contents 