In this paper, we report scalable 5 -level stacked gate-all-around (GAA) In 0.53 Ga0.47As multi-bridge channel FETs (MBCFETs), with careful attention paid to fluorine migration. At its heart, we maintained temperature of all the unit process steps below 300 °C and inserted an n-InP ledge into a top ${In}_{0.52}\mathrm{Al}_{0.48}\mathrm{As}$ sacrificial layer to suppress $\mathrm{F}^{-}$-induced donor passivation. In addition, we used a selectively regrown $n+{In}_{0.53}\mathrm{Ga}_{0.47}$ As contact formation by MOCVD and precision dry etching. The dry etching process resulted in a highly vertical etching slope along both the $\mathrm{S}/\mathrm{D}$ and Wg directions. The fabricated $L_{g}=60\mathrm{~nm}$ MBCFET showed a record combination of $S=76\mathrm{mV}/\mathrm{dec},g_{m_{-}\max}=13.7 \mathrm{mS}/\mu\mathrm{m},I_{ON}=2.24\mathrm{~mA}/\mu\mathrm{m}$ and $Q=180$ at $V_{DS}=0.5\mathrm{~V}$.