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BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond | IEEE Conference Publication | IEEE Xplore

BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond


Abstract:

We present novel back-end-of-line (BEOL) copper interconnect integration for advanced technology nodes using integrated selective barrier copper barrier seed (CuBS) proce...Show More

Abstract:

We present novel back-end-of-line (BEOL) copper interconnect integration for advanced technology nodes using integrated selective barrier copper barrier seed (CuBS) process, annealing and chemical mechanical planarization (CMP). Electrical tests (resistance, reliability) combined with Materials-to-Systems Co-Optimization (MSCO™) simulations confirm significant power-performance-area (PPA) gains for 3nm technology node and beyond.
Date of Conference: 11-16 June 2023
Date Added to IEEE Xplore: 24 July 2023
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Conference Location: Kyoto, Japan

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