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A Fingertip-Mimicking 12×16 200μm-Resolution e-skin Taxel Readout Chip with per-Taxel Spiking Readout and Embedded Receptive Field Processing | IEEE Conference Publication | IEEE Xplore

A Fingertip-Mimicking 12×16 200μm-Resolution e-skin Taxel Readout Chip with per-Taxel Spiking Readout and Embedded Receptive Field Processing


Abstract:

This work describes an electronic skin (e-skin) taxel readout chip in 0.18 \mu \mathrm{m} CMOS technology, achieving the highest reported spatial resolution of $200 \mu...Show More

Abstract:

This work describes an electronic skin (e-skin) taxel readout chip in 0.18 \mu \mathrm{m} CMOS technology, achieving the highest reported spatial resolution of 200 \mu \mathrm{m}, comparable to human fingertips. A key innovation is the integration on chip of \mathrm{a}12 \times 16 taxel array with per-taxel signal conditioning frontend and spiking readout combined with embedded neuromorphic first-order processing through Complex Receptive Fields (CRFs). The chip has been designed to incorporate a polyvinylidene fluoride (PVDF)-based piezoelectric sensor layer. Experimental results show that Spiking Neural Network (SNN)-based classification of the chip’s spatiotemporal spiking output for input tactile stimuli such as texture and flutter frequency achieves excellent accuracies up to 97.1% and 99.2% of classification accuracy, respectively. This is despite using only a small 256-neuron SNN classifier, a low equivalent spike encoding resolution of 3-4 bits, a sub-Nyquist 2.2kHz population spiking rate, and a state-of-the-art per-taxel (12.33nW) and system (75 \mu \mathrm{W} -5mW) power consumption.
Date of Conference: 11-16 June 2023
Date Added to IEEE Xplore: 24 July 2023
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Conference Location: Kyoto, Japan

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