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Cloud Computing Applied for Numerical Study of Thermal Characteristics of SIP

Cloud Computing Applied for Numerical Study of Thermal Characteristics of SIP

S. K. Maharana, Praveen B. Mali, Ganesh Prabhakar, Sunil J, Vignesh Kumar
Copyright: © 2011 |Volume: 1 |Issue: 3 |Pages: 10
ISSN: 2156-1834|EISSN: 2156-1826|EISBN13: 9781613505977|DOI: 10.4018/ijcac.2011070102
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MLA

Maharana, S. K., et al. "Cloud Computing Applied for Numerical Study of Thermal Characteristics of SIP." IJCAC vol.1, no.3 2011: pp.12-21. http://doi.org/10.4018/ijcac.2011070102

APA

Maharana, S. K., Mali, P. B., Prabhakar, G., J, S., & Kumar, V. (2011). Cloud Computing Applied for Numerical Study of Thermal Characteristics of SIP. International Journal of Cloud Applications and Computing (IJCAC), 1(3), 12-21. http://doi.org/10.4018/ijcac.2011070102

Chicago

Maharana, S. K., et al. "Cloud Computing Applied for Numerical Study of Thermal Characteristics of SIP," International Journal of Cloud Applications and Computing (IJCAC) 1, no.3: 12-21. http://doi.org/10.4018/ijcac.2011070102

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Abstract

Thermal management of integrated circuit (IC) and system-in-package (SIP) has gained importance as the power density and requirement for IC design have increased and need exists to analyse the heat dissipation performance characteristics of IC under use. In this paper, the authors examine the thermal characteristics of materials of IC. The authors leverage Cloud Computing architecture to remotely compute the dissipation performance parameters. Understanding thermal dissipation performance, which explains the thermal management of IC, is important for chip performance, as well as power and energy consumption in a chip or SIP. Using architectural understanding of Software as a Service (SaaS), the authors develop an efficient, fast, and secure simulation technique by leveraging control volume method (CVM) of linearization of relevant equations. Three chips are kept in tandem to make it a multi-chip module (MCM) to realise it as a smaller and lighter package. The findings of the study are presented for different dimensions of chips inside the package.

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