Welcome to the InfoSci Platform
Reference Hub5
Nanorobot-Based Handling and Transfer of Individual Silicon Nanowires

Nanorobot-Based Handling and Transfer of Individual Silicon Nanowires

Malte Bartenwerfer, Sergej Fatikow
Copyright: © 2012 |Volume: 2 |Issue: 2 |Pages: 13
ISSN: 2156-1664|EISSN: 2156-1656|EISBN13: 9781466613041|DOI: 10.4018/ijimr.2012040103
Cite Article Cite Article

MLA

Bartenwerfer, Malte, and Sergej Fatikow. "Nanorobot-Based Handling and Transfer of Individual Silicon Nanowires." IJIMR vol.2, no.2 2012: pp.34-46. http://doi.org/10.4018/ijimr.2012040103

APA

Bartenwerfer, M. & Fatikow, S. (2012). Nanorobot-Based Handling and Transfer of Individual Silicon Nanowires. International Journal of Intelligent Mechatronics and Robotics (IJIMR), 2(2), 34-46. http://doi.org/10.4018/ijimr.2012040103

Chicago

Bartenwerfer, Malte, and Sergej Fatikow. "Nanorobot-Based Handling and Transfer of Individual Silicon Nanowires," International Journal of Intelligent Mechatronics and Robotics (IJIMR) 2, no.2: 34-46. http://doi.org/10.4018/ijimr.2012040103

Export Reference

Mendeley
Favorite Full-Issue Download

Abstract

Presented is a new experimental implementation for well-directed handling of silicon nanowires with diameters of less than 100 nm and length of up to 10 µm. Handling device is a robotic setup of several centimeters in size and nanometer accuracy, mounted inside a SEM (Scanning Electron Microscopy) chamber. The actual transfer of the nanowires is done by this setup from a production substrate to a different electrode substrate by using an STM (Scanning Tunneling Microscope) tungsten tip as carrier, gas based adhesive bonding, and FIB (Focused Ion Beam) assisted milling. The goal of this series is the placement on the electrodes in order to facilitate further electrical characterization measurements. The presented handling technique for nanoscale objects facilities an accurate picking and placing of individual nanowires on the one hand and a transfer over several centimeters to a complete different substrate on the other hand. Advantages, prospects and limits are investigated particularly with regard to a handling automation for applications.

Request Access

You do not own this content. Please login to recommend this title to your institution's librarian or purchase it from the IGI Global bookstore.