Abstract
It is an accepted fact that process scaling and operating frequency both contribute to increasing integrated circuit power dissipation due to interconnect. Extrapolating this trend leads to a red brick wall which only radically different interconnect architectures and/or technologies will be able to overcome. The aim of this chapter is to explain how, by exploiting recent advances in integrated optical devices, optical interconnect within systems on chip can be realised. We describe our vision for heterogeneous integration of a photonic “above-IC” communication layer. Two applications are detailed: clock distribution and data communication using wavelength division multiplexing. For the first application, a design method will be described, enabling quantitative comparisons with electrical clock trees. For the second, more long-term, application, our views will be given on the use of various photonic devices to realize a network on chip that is reconfigurable in terms of the wavelength used.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
M. Amann, M. Ortsiefer, and R. Shau: 2002, ‘Surface-emitting Laser Diodes for Telecommunications’. In: Proc. Symp. Opto-and Microelectronic Devices and Circuits.
T. Baba: 1997, ‘Photonic Crystals and Microdisk Cavities Based on GaInAsP-InP System’. IEEE J. Selected Topics in Quantum Electronics 3.
Y. Cao, T. Sato, D. Sylvester, M. Orchansky, and C. Hu: 2000, ‘New Paradigm of Predictive MOSFET and Interconnect Modeling for Early Circuit Design’. In: Proc. Custom Integrated Circuit Conference.
S. Cho et al.: 2002, ‘Integrated detectors for embedded optical interconnections on electrical boards, modules and integrated circuits’. IEEE J. Sel. Topics in Quantum Electronics 8.
A. Filios et al.: 2003, ‘Transmission performance of a 1.5–µm 2.5-Gb/s directly modulated tunable VCSEL’. IEEE Phot. Tech. Lett. 15.
M. Fujita, A. Sakai, and T. Baba: 1999, ‘Ultrasmall and ultralow threshold GaInAsP-InP microdisk injection lasers:Design, fabrication, lasing characteristics and spontaneous emission factor’. IEEE J. Sel. Topics in Quantum Electronics 5.
M. Fujita, R. Ushigome, and T. Baba: 2000, ‘Continuous wave lasing in GaInAsP microdisk injection laser with threshold current of 40µA’. IEEElectron. Lett. 36.
M. Ingels and M. S. J. Steyaert: 1999, ‘A 1-Gb/s, 0.7µm CMOS Optical Receiver with FullRail-to-Rail Output Swing’. IEEE J. Solid-State Circuits 34(7).
I. Kimukin et al.: 2002, ‘InGaAs-Based High-Performance p-i-n Photodiodes’. IEEE Phot. Tech. Lett. 26(3).
K. Lee et al.: 2001, ‘Fabrication of ultralow-loss Si/SiO2 waveguides by roughness reduction’. Optics Letters 26.
J. Liu et al.: 2002, ‘Ultralow-threshold sapphire substrate-bonded topemitting 850-nm VCSEL array’. IEEE Phot. Lett. 14.
J. Morikuni et al.: 1994, ‘Improvements to the standard theory for photoreceiver noise’. IEEE J. Lightwave Technology 12.
I. O’Connor, F. Mieyeville, F. Tissafi-Drissi, G. Tosik, and F. Gaffiot: 2003, ‘Predictive design space exploration of maximum bandwidth CMOS photoreceiver preamplifiers’. In: Proc. IEEE International Conference on Electronics, Circuits and Systems.
A. Sakai, T. Fukazawa, and T. Baba: 2002, ‘Low Loss Ultra-Small Branches in a Silicon Photonic Wire Waveguide’. IEICE Tran. Electron. E85-C.
A. Sakai, G. Hara, and T. Baba: 2001, ‘Propagation Characteristics of Ultrahigh-Δ Optical Waveguide on Silicon-on-Insulator Substrate’. Jpn. J. Appl. Phys. — Part 2 40.
S. Schultz, E. Glytsis, and T. Gaylord: 2000, ‘Design, Fabrication, and Performance of Preferential-Order Volume Grating Waveguide Couplers’. Applied Optics-IP 39.
Semiconductor Industry Association: 2003, ‘International Technology Roadmap for Semiconductors’.
G. Tosik, F. Gaffiot, Z. Lisik, I. O’Connor, and F. Tissafi-Drissi: 2004, ‘Power dissipation in optical and metallic clock distribution networks in new VLSI technologies’. IEEElec. Lett. 4(3).
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2004 Springer Science + Business Media, Inc.
About this chapter
Cite this chapter
O’Connor, I., Gaffiot, F. (2004). On-Chip Optical Interconnect for Low-Power. In: Macii, E. (eds) Ultra Low-Power Electronics and Design. Springer, Boston, MA. https://doi.org/10.1007/1-4020-8076-X_2
Download citation
DOI: https://doi.org/10.1007/1-4020-8076-X_2
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4020-8075-3
Online ISBN: 978-1-4020-8076-0
eBook Packages: Springer Book Archive