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Experience from Mobile Application Service Framework in WIP

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EurAsia-ICT 2002: Information and Communication Technology (EurAsia-ICT 2002)

Part of the book series: Lecture Notes in Computer Science ((LNCS,volume 2510))

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Abstract

As there is a rapid growth of service market and technologies of mobile applications, many kinds of platforms, service, business models, devices, and requirements for mobile business service are under consideration. In case of Korea, it has been experienced for years in applying mobile application service to the real world. In technical domain, one of the hot issues in development of application service is different development environment of each wireless carrier companies. This issue causes a problem to the application service providing companies in developing the same service to fit each different platform for their customers, the wireless carrier companies. A forum called Korea Wireless Internet Standardization (KWIS) was established for solving technical problems in developing the mobile application service. In April, 2002, the forum annonuced the recommended technical specifications of ‘Wireless Internet Platform (WIP)’ as one of the draft domestic de facto standards in Korea. In this paper, the common application service framework of ‘Wireless Internet Platform’ is presented. The proposed framework, called ‘Mobile Application Service (MAS)’ framework, is composed of Application Adaptation Layer (AAL) and Handset Adaptation Layer (HAL). In this paper, the AAL, the application component of the MAS framework, is discussed. The requirements analysis of content provider, handset vendor, wireless carrier, and mobile user for mobile service application are discussed in this paper.

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References

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© 2002 Springer-Verlag Berlin Heidelberg

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Lim, S., Song, Y. (2002). Experience from Mobile Application Service Framework in WIP. In: Shafazand, H., Tjoa, A.M. (eds) EurAsia-ICT 2002: Information and Communication Technology. EurAsia-ICT 2002. Lecture Notes in Computer Science, vol 2510. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-36087-5_105

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  • DOI: https://doi.org/10.1007/3-540-36087-5_105

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-00028-0

  • Online ISBN: 978-3-540-36087-2

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