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Transition Management of Software Process Improvement

  • Conference paper
  • First Online:
Product Focused Software Process Improvement (PROFES 2002)

Part of the book series: Lecture Notes in Computer Science ((LNCS,volume 2559))

Abstract

Process improvement studies have tended to focus on software process improvement (SPI) framework such as the generic “best practices” models (e.g., CMM and SPICE), SPI Models (e.g., PDCA and IDEAL), and Quality Improvement Paradigm (QIP). However, there are still difficulties due to the resistance within the organization and the tendency to return to the previous state. In this study, we point out it is the transition part that is overlooked in the SPI Model and explain how we apply transition management to software process improvement in the Software Center, Samsung Electronics Co. Ltd. The study also shows that considering transition management during SPI planning leads to more accurate estimation for time and goal achievement of SPI work.

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Author information

Authors and Affiliations

  1. Samsung Electronics Co. Ltd, Software Center, Corporate R&D Center, 599-4 ShinSa-Dong, 135-120, Seoul, KangNam-Gu, Korea

    Seon-ah Lee

  2. Dept. of Computer Science and Engineering, Ewha Womans University, Seoul, Korea

    Byoungju Choi

Authors
  1. Seon-ah Lee
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  2. Byoungju Choi
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Editor information

Editors and Affiliations

  1. Department of Information Processing Science, University of Oulu, P.O. Box 3000, 90014, Oulun yliopisto, Finland

    Markku Oivo

  2. VTT Electronics, VTT Technical Research Centre of Finland, P.O. Box 1100, 90571, Oulu, Finland

    Seija Komi-Sirviö

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© 2002 Springer-Verlag Berlin Heidelberg

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Lee, Sa., Choi, B. (2002). Transition Management of Software Process Improvement. In: Oivo, M., Komi-Sirviö, S. (eds) Product Focused Software Process Improvement. PROFES 2002. Lecture Notes in Computer Science, vol 2559. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-36209-6_5

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  • DOI: https://doi.org/10.1007/3-540-36209-6_5

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-00234-5

  • Online ISBN: 978-3-540-36209-8

  • eBook Packages: Springer Book Archive

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