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Effect of H-ARQ on Packet Call Throughput in UTRA TDD HSDPA

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Mobile Communications (CIC 2002)

Part of the book series: Lecture Notes in Computer Science ((LNCS,volume 2524))

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Abstract

High speed downlink packet access (HSDPA) is an advanced proposal in 3GPP framework to ensure high peak and average packet data rate. HARQ is a promising technique that can improve system performance significantly in HSDPA, and much research work has been done in the study of its cell throughput performance. However, in this paper packet call throughput comparison between Chase combining and conventional ARQ is emphasized for web browsing service in UTRA TDD HSDPA. From analysis it can be seen that the improvement of H-ARQ on packet call throughput is related to system load. Based on the analysis the ways to guarantee QoS is also discussed. Using a dynamic system simulator for UTRA TDD HSDPA, simulation results are obtained and confirm the analysis.

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Author information

Authors and Affiliations

  1. Center of Wireless Communications, Beijing University of Posts and Telecom, Beijing

    Peng Tao, Peng Mugen & Wang Wenbo

  2. Nokia (China) R&D Center, No.11 HePingLi DongJie, 100013, Beijing, China

    Wei Chao

Authors
  1. Peng Tao
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  2. Peng Mugen
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  3. Wei Chao
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  4. Wang Wenbo
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Editor information

Editors and Affiliations

  1. B718 EE Engineering, Dept. of Engineering, Yonsei University, 134 Shinchon-dong, Seodaemun-gu, 120-749, Seoul, Korea

    Jaiyong Lee

  2. Department of Electronic Engineering, Korea University, 5-1 Anam-Dong Sungbuk-Ku, 136-701, Seoul, Korea

    Chul-Hee Kang

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© 2003 Springer-Verlag Berlin Heidelberg

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Tao, P., Mugen, P., Chao, W., Wenbo, W. (2003). Effect of H-ARQ on Packet Call Throughput in UTRA TDD HSDPA. In: Lee, J., Kang, CH. (eds) Mobile Communications. CIC 2002. Lecture Notes in Computer Science, vol 2524. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-36555-9_8

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  • DOI: https://doi.org/10.1007/3-540-36555-9_8

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-00732-6

  • Online ISBN: 978-3-540-36555-6

  • eBook Packages: Springer Book Archive

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