Keywords and Synonyms
Layout ; Alignment ; Packing; Dissection
Problem Definition
The problem is concerned with efficient coding of the constraint that defines the placement of objects on a plane without mutual overlapping. This has numerous motivations, especially in the design automation of integrated semiconductor chips, where almost hundreds of millions of rectangular modules shall be placed within a small rectangular area (chip). Until 1994, the only known coding efficient in computer aided design was Polish‐Expression [1]. However, this can only handle a limited class of placements of the slicing structure. In 1994 Nakatake, Fujiyoshi, Murata, and Kajitani [2], and Murata, Fujiyoshi, Nakatake, and Kajitani [3] were finally successful to answer this longstanding problem in two contrasting ways. Their code names are Bounded‐Sliceline-Grid (BSG) for floorplanning and Sequence-Pair(SP) for placement....
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Recommended Reading
Wong, D.F., Liu, C.L.: A new algorithm for floorplan design. In: ACM/IEEE Design Automation Conference (DAC), November 1985, 23rd, pp. 101–107
Nakatake, S., Murata, H., Fujiyoshi, K., Kajitani, Y.: Bounded Sliceline Grid (BSG) for module packing. IEICE Technical Report, October 1994, VLD94-66, vol. 94, no. 313, pp. 19–24 (in Japanese)
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Murata, H., Nakatake, S., Fujiyoshi, K., Kajitani, Y.: VLSI Module placement based on rectangle‐packing by Sequence-Pair. IEEE Trans. Comput. Aided Design (TCAD) 15(12), 1518–1524 (1996)
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Sakanushi, K., Kajitani, Y., Mehta, D.: The quarter-state-sequence floorplan representation. In: IEEE TCAS-I: 50(3), 376–386 (2003)
Kodama, C., Fujiyoshi, K.: Selected Sequence-Pair: An efficient decodable packing representation in linear time using Sequence-Pair. In: Proc. ASP-DAC 2003, pp. 331–337
Kajitani, Y.: Theory of placement by Single‐Sequence Realted with DAG, SP, BSG, and O‑tree. In: International Symposium on Circuts and Systems, May 2006
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Kajitani, Y. (2008). Floorplan and Placement. In: Kao, MY. (eds) Encyclopedia of Algorithms. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-30162-4_145
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DOI: https://doi.org/10.1007/978-0-387-30162-4_145
Publisher Name: Springer, Boston, MA
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