Abstract
We introduce UltraSurfaces (USs), a new material design vision taking advantage of the latest developments in Electronic and Smart Materials, and their integration in layered substrates and other materials. The USs can detect phenomena in the environment, record and exchange data while being controlled by remote technologies, interact with users by changing their physical properties, like color, form, sound or light emission, and providing feedback to the user. The USs go a step further than ubiquitous IoT, smart products and environments, enabling new potentialities for any surface to be applied in Future Scenarios of spaces and products. Adopting a Human and User-Centered Design approach, we have been envisioned two Future Scenarios and concepts to convey a better understanding of USs, as well as their potentiality for applications and user’s appreciation. We aim to catch the interest of material industries and highlight the challenges design is facing in exploiting the new hybrid materiality of USs.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Notes
- 1.
EMs are a combination of different materials. They include semiconductors, metals, polymers, ceramics, and smart materials to build highly functional systems such as integrated electronic circuits, communication devices, sensors, flat panel displays, lasers, batteries, fuel cells, etc.
- 2.
MADEC (Material Design Culture Research Center) is a knowledge center at Politecnico di Milano, Design Department. Our approach is design-driven innovation in terms of a possible and desirable future, with a Human and User-Centered-Design perspective.
References
Haseeh, A.S.M.A.: Electronic Materials. Elsevier, Amsterdam (2016)
Guo, X., Xue, Z., Zhang, Y.: Manufacturing of 3D multifunctional microelectronic devices: challenges and opportunities. NPG Asia Mat. 11, 29 (2019)
European Union (2018). https://cordis.europa.eu/project/rcn/214070/factsheet/it
Mandal, S., Dell’Erba, G., Luzio, A., Bucella, S.G., Perinot, A., Alberto Calloni, A., Berti, G., Bussetti, G., Duò, L., Facchetti, A., Noh, Y.-Y., Caironi, M.: Fully-printed, all-polymer, bendable and highly transparent complementary logic circuits. Org. Electr. 20, 132–141 (2015)
Xu, Y., Wu, X., Guo, X., Kong, B., Zhang, M., Qian, X., Mi, S., Sun, W.: The boom in 3D-printed sensor technology. Sensors 17(1166), 1–37 (2017)
Floridi. L.: La quarta rivoluzione. Come l’infosfera sta trasformando il mondo, Raffaello Cortina Editore, Milano (2017)
Russo, A.C., Ferrara, M.: Smart Solutions, “Smart Aesthetics”? Des. J. 20(1), S342–S353 (2017)
Rozendaal, M.: Object with intents. Interactions 23(3), 62–65 (2016)
Author information
Authors and Affiliations
Corresponding authors
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2020 Springer Nature Switzerland AG
About this paper
Cite this paper
Ferrara, M., Pasetti, C. (2020). UltraSurfaces: A New Material Design Vision. In: Ahram, T., Karwowski, W., Vergnano, A., Leali, F., Taiar, R. (eds) Intelligent Human Systems Integration 2020. IHSI 2020. Advances in Intelligent Systems and Computing, vol 1131. Springer, Cham. https://doi.org/10.1007/978-3-030-39512-4_139
Download citation
DOI: https://doi.org/10.1007/978-3-030-39512-4_139
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-030-39511-7
Online ISBN: 978-3-030-39512-4
eBook Packages: Intelligent Technologies and RoboticsIntelligent Technologies and Robotics (R0)