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Development of an Instructional Package on Embedded System Design: Backward Design Learning Approach

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The Impact of the 4th Industrial Revolution on Engineering Education (ICL 2019)

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 1135))

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Abstract

This research aims to develop and construct the instructional package on embedded system design using backward design learning approach. The instructional packages consist of a teacher manual on embedded system design, the PowerPoint presentation, software tools, achievement tests and the Likert scale questionnaires. The evaluated result of quality by using 7 experts was to have very high appropriate with the average value equaled to 4.14. Then, the developed backward design learning approach was tried out using sampling group of 16 bachelor students registered in the digital system design course, electrical technology curriculum in semester of 2/2018, at Muban Chombueng Rajabhat University, Ratchaburi, Thaialnd. The research result found that the efficiency of developed instructional package was agreement to the Meguigans theory with Meguigans’ value equaled to 1.07. The student’s satisfaction for developed instructional packages was at a high level with the average value equaled to 4.13. Thus, the developed instructional package on embedded system design using backward design learning approach can be used effectively in the electrical and electronics engineering.

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Acknowledgment

We would like sincerely to thank you to the Faculty of Technical Education, King Mongkut’s University of Technology North Bangkok that supports funding for this research.

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Correspondence to Surasak Inchan or Somsak Akatimagool .

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Inchan, S., Akatimagool, S. (2020). Development of an Instructional Package on Embedded System Design: Backward Design Learning Approach. In: Auer, M., Hortsch, H., Sethakul, P. (eds) The Impact of the 4th Industrial Revolution on Engineering Education. ICL 2019. Advances in Intelligent Systems and Computing, vol 1135. Springer, Cham. https://doi.org/10.1007/978-3-030-40271-6_21

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