Abstract
ZACube-2 is 3-Unit nanosatellite operating in low earth orbit. As for many electronic devices, the temperature within the satellite is an important factor for the function of some components. Following the assumption that thermal behavior can be modelled by software, ZACube-2 needs to be modelled, simplified, meshed and analysed in NX 12, a computer aided design and simulation software. To do so required an accurate but simple finite element model of the printed circuit boards (PCBs) for the various satellite subsystems. Specific material properties and finite element methods for modelling PCBs were found. These properties and methods were found by simulating the PCB behavior under thermal loading and comparing to that of tested specimens. The results showed an accuracy between the simulated and tested results of within 3%. The PCBs are used for almost all electronic hardware. They are complex and the approach used introduces a way of modelling them in a simplified but accurate method and using the findings for thermal modelling. These methods and procedures can be used in various industries that have electronics that are at the risk of overheating to improve the designing process and the efficiency of the product.
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Wendland, A., Bumann, M., Martin, S., Niemann, J., Bosman, S. (2020). Optimizing System Design Through Thermal Analysis with Cubesatellite as Case Study. In: Yilmaz, M., Niemann, J., Clarke, P., Messnarz, R. (eds) Systems, Software and Services Process Improvement. EuroSPI 2020. Communications in Computer and Information Science, vol 1251. Springer, Cham. https://doi.org/10.1007/978-3-030-56441-4_30
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DOI: https://doi.org/10.1007/978-3-030-56441-4_30
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