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Simulation of the Field of View in AR and VR Headsets

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Virtual, Augmented and Mixed Reality (HCII 2021)

Part of the book series: Lecture Notes in Computer Science ((LNISA,volume 12770))

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Abstract

Technical parameters of today’s Optical See-Through Head Mounted Displays (OST-HMDs) do not fully match the industrial requirements yet: Especially the small field of view (FoV) of current OST-HMDs is a hindrance for industrial use. The FoV is a technical parameter the user is always confronted with while the immersive experience of Augmented Reality takes place: It defines the extent of the observable augmented world where virtual objects can be perceived. This experience is limited by the augmented objects being cut off at the screen boundaries. This paper describes a scientific approach to simulate the FoV of OST-HMDs with the help of AR and VR devices. It aims at enabling tests and validation of necessary FoV-specifications of HMDs. Therefore, a study to simulate different FoVs and evaluate the necessary FoV size for manual two-handed automotive assembly tasks is presented. Results show significant differences in ratings between AR and VR but nearly no differences between the participant groups “AR/VR experts” and “assembly line workers”.

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Author information

Authors and Affiliations

  1. Volkswagen AG, Wolfsburg, Germany

    Sarah Brauns

  2. Anhalt University of Applied Sciences, Köthen, Germany

    Johannes Tümler

Authors
  1. Sarah Brauns
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  2. Johannes Tümler
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Correspondence to Johannes Tümler .

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Editors and Affiliations

  1. U.S. Army Research Laboratory, Aberdeen Proving Ground, MD, USA

    Jessie Y. C. Chen

  2. U.S. Army Combat Capabilities Development Command Soldier Center, Orlando, FL, USA

    Gino Fragomeni

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Brauns, S., Tümler, J. (2021). Simulation of the Field of View in AR and VR Headsets. In: Chen, J.Y.C., Fragomeni, G. (eds) Virtual, Augmented and Mixed Reality. HCII 2021. Lecture Notes in Computer Science(), vol 12770. Springer, Cham. https://doi.org/10.1007/978-3-030-77599-5_21

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  • DOI: https://doi.org/10.1007/978-3-030-77599-5_21

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-77598-8

  • Online ISBN: 978-3-030-77599-5

  • eBook Packages: Computer ScienceComputer Science (R0)

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