Abstract
Reliability and yield are major concerns of nano-scaled devices. Bias temperature instability (BTI) has always been one of the major reliability issue for the semiconductor transistors. BTI induced interface traps play a vital role in defining important figures of merits such as threshold voltage (V\(_{TH}\)), ON current, and \(I_{ON}/I_{OFF}\) in terms of the reliability of the transistor, especially in p-type devices. In this paper, for the first time, we investigate the impact of the Si-SiO\(_{2}\) interface traps (N\(_{it}\)) on the performance of the p-type Negative Capacitance Nanosheet (NC-NS) FET. Using well-calibrated TCAD models our results demonstrate that: 1) the end of life (EOL) concentration (i.e., shift of threshold voltage (\(\Delta V_{TH}= 50\) mV) in threshold voltage degradation is improved in NC NSFET as compared to baseline NSFET; 2) the smaller degradation in \(I_{ON}/I_{OFF}\) and subthreshold slope (SS) is achieved in NC-NSFET. We investigate and evaluate the performance metrics of NC-NS FET in comparison to the baseline NSFET. Our result reveals that NC-NSFET exhibit 2.5 times less degradation in V\(_{TH}\), and 11.76x less degradation in \(I_{ON}/I_{OFF}\) ratio.
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Gupta, A. et al. (2022). Unveiling the Impact of Interface Traps Induced on Negative Capacitance Nanosheet FET: A Reliability Perspective. In: Shah, A.P., Dasgupta, S., Darji, A., Tudu, J. (eds) VLSI Design and Test. VDAT 2022. Communications in Computer and Information Science, vol 1687. Springer, Cham. https://doi.org/10.1007/978-3-031-21514-8_8
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