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i-Bond: A Next Generation Bond’s Issuing Service System

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Blockchain – ICBC 2022 (ICBC 2022)

Part of the book series: Lecture Notes in Computer Science ((LNCS,volume 13733))

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Abstract

To address the issues of the bond market’s low transparency, information disclosure efficiency, and rating’s ability to reveal risks, this paper proposes a blockchain-based bond primary market issuance service system, for companies to issue bonds efficiently at low cost. This paper presents the architecture design of the next-generation decentralised bond issuance service system. In addition, this paper also presents a new bond issuance bidding mechanism. Through the two-dimensional auction, the collusion between bond issuers has significantly been reduced, and the hidden danger of market manipulation has been eliminated. A prototype system was built on Hyperledger for proof of concept and performance evaluation.

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Author information

Authors and Affiliations

  1. School of Electrical and Information Engineering, The University of Sydney, Darlington, Australia

    Ji Liu, Dong Yuan & Shiping Chen

  2. CSIRO DATA61, Sydney, Australia

    Ji Liu, Yilin Sai & Shiping Chen

  3. Shenzhen Institute of Information Technology, Shenzhen, China

    Zheng Xu

  4. Central University of Finance and Economics, Beijing, China

    Yanmei Zhang

Authors
  1. Ji Liu
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  2. Zheng Xu
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  3. Yilin Sai
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  4. Yanmei Zhang
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  5. Dong Yuan
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  6. Shiping Chen
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Corresponding author

Correspondence to Shiping Chen .

Editor information

Editors and Affiliations

  1. CSIRO Data61 and UNSW, Canberra, ACT, Australia

    Shiping Chen

  2. Indian Institute of Technology Bombay, Mumbai, India

    Rudrapatna K. Shyamasundar

  3. Kingdee International Software Group Co., Ltd., Shenzhen, China

    Liang-Jie Zhang

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Liu, J., Xu, Z., Sai, Y., Zhang, Y., Yuan, D., Chen, S. (2022). i-Bond: A Next Generation Bond’s Issuing Service System. In: Chen, S., Shyamasundar, R.K., Zhang, LJ. (eds) Blockchain – ICBC 2022. ICBC 2022. Lecture Notes in Computer Science, vol 13733. Springer, Cham. https://doi.org/10.1007/978-3-031-23495-8_3

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  • DOI: https://doi.org/10.1007/978-3-031-23495-8_3

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-031-23494-1

  • Online ISBN: 978-3-031-23495-8

  • eBook Packages: Computer ScienceComputer Science (R0)

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