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Modeling of Thermal Processes in a Microcontroller System with the Use of Hybrid, Fractional Order Transfer Functions

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Advanced, Contemporary Control (PCC 2023)

Part of the book series: Lecture Notes in Networks and Systems ((LNNS,volume 708))

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Abstract

In the paper the problem of modeling of thermal processes in microcontroller system is addressed. The proposed models allow to describe thermal processes during work of an evaluation system. The temperature in critical places of the system is measured using thermal camera. The proposed models have the form of hybrid transfer functions, containing both Integer Order (IO) and Fractional Order (FO) parts. The step responses of the proposed transfer functions are computed analytically. Results of experiments show that the proposed models are more accurate in the sense of Mean Square Error (MSE) cost function than typical transfer function models with delay. The proposed models can be applied to predict of overheating of microcotroller systems.

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Acknowledgments

This paper was sponsored by AGH UST project no 16.16.120.773.

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Correspondence to Krzysztof Oprzędkiewicz .

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Oprzędkiewicz, K., Rosół, M., Mitkowski, W. (2023). Modeling of Thermal Processes in a Microcontroller System with the Use of Hybrid, Fractional Order Transfer Functions. In: Pawelczyk, M., Bismor, D., Ogonowski, S., Kacprzyk, J. (eds) Advanced, Contemporary Control. PCC 2023. Lecture Notes in Networks and Systems, vol 708. Springer, Cham. https://doi.org/10.1007/978-3-031-35170-9_15

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