Abstract
A multi-objective optimization on a system of microchannels with environmentally friendly liquid ammonia is presented. Further, comparative studies were done on two approaches of obtaining the convective heat transfer coefficient necessary for the procedure; from the conventional Nusselt number correlation and that from experimentally measured data. The thermohydrodynamic performance of the coolant agrees well with theory with a higher resistance associated with the experimentally obtained data due to overall contributions from experimental apparatus generally not considered in mathematical representations of actual processes. The study shows that the pairing of a fast and simple evolutionary algorithm method as MOGA with experimental data is a powerful combination when new coolants are being explored for replacements in current systems. The results would be useful in providing the trends and patterns needed to evaluate the potentials of new coolants in microchannels.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Kandlikar, S.G., Grande, W.J.: Evolution of microchannel flow passages-thermohydraulic performance and fabricationtechnology. Heat Transfer Eng. (24), 3–17 (2003)
Kleiner, M.B., Kuhn, S.A., Haberger, K.: High performance forced air cooling scheme employing microchannel heat exchangers. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A 20(4), 795–804 (1995)
Zhimin, W., Fah, C.K.: Optimum thermal design of microchannel heat sinks. In: Proceeding of the 1997 1st Electronic Packaging Technology Conference, EPTC, Singapore, pp. 123–129 (1997)
Iyengar, M., Garimella, S.: Design and optimization of microchannel cooling systems. IEEE Transactions, 54–62 (2006)
Hu, G., Xu, S.: Optimization design of microchannel heat sink based on SQP Method and numerical simulation. In: Proceeding of 2009 IEEE International Conference on Applied Superconductivity and Electromagnetic Devices, China, pp. 89–92 (2009)
Escher, W., Brunschwiler, T., Shalkevich, N., Shalkevich, A., Burgi, T., Michel, B., Poulikakos, D.: On the cooling of electronics with nanofluids. Journal of Heat Transfer (133), 1–11 (2011)
I.,S.R.: Nanofluid as a coolant for electronic devices (cooling of electronic devices). International Journal of Thermal Sciences (32), 76–82 (2012)
Ahmed, M.A., Normah, M.G., Robiah, A.: Thermal and Hydrodynamic Analysis of Microchannel Heat Sinks: A Review. Renewable and Sustainable Energy Reviews (21), 614–622 (2013), doi:10.1016/j.rser.2013.01
Philips, R.J.: Microchannel heat sinks. In: Bar-Cohen, A., Kraus, A.D. (eds.) Advances in Thermal Modeling of Electronic Components and Systems, vol. 2, pp. 109–184. ASME Press, New York (1990)
Knight, R.W., Goodling, J.S., Gross, B.E.: Optimal thermal design of air cooled forced convection finned heat sinks – experimental verification. IEEE Transaction on Components, Hybrids and Manufacturing Technology, 602–212 (1992)
Kleiner, M.B., Kuhn, S.A., Haberger, K.: High performance forced air cooling scheme employing microchannel heat exchangers. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A 20(4), 795–804 (1995)
Fedorov, A.G., Viskanta, R.: Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging. Int. J. Heat Mass Transfer 43, 399–415 (2000)
Khan, W.A., Kadri, M.B., Ali, Q.: Optimization of microchannel heat sinks using genetic algorithm. Heat Transfer Engineering 34(4), 279–287 (2013)
Tuckerman, D.B., Pease, R.F.: High performance heat sinking for VLSI. IEEE Electron Devices Lett. EDL-2, 126–129 (1981)
Adham, A.M., Mohd-Ghazali, N., Ahmad, R.: Multi-objective Optimization Algorithms for Microchannel Heat Sink Design. In: Ali, M., Bosse, T., Hindriks, K.V., Hoogendoorn, M., Jonker, C.M., Treur, J. (eds.) Contemporary Challenges & Solutions in Applied AI. SCI, vol. 489, pp. 169–174. Springer, Heidelberg (2013)
http://www.iiar.org (visited September 19, 2013)
Wen, Z., Choo, F.K.: The optimum thermal design of microchannel heat sinks. In: Proceedings of the 11th IEEE Electronic Packaging Technology Conference, Singapore, pp. 123–129 (1997)
Kim, S.J., Kim, D.: Forced convection in microstructures for electronic equipment cooling. J. Heat Transfer (121), 639–645 (1999)
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2014 Springer International Publishing Switzerland
About this paper
Cite this paper
Mohd-Ghazali, N., Jong-Taek, O., Chien, N.B., Chi, KI., Zolpakar, N.A., Ahmad, R. (2014). Multiobjective Optimization of Microchannels with Experimental Convective Heat Transfer Coefficient of Liquid Ammonia. In: Ali, M., Pan, JS., Chen, SM., Horng, MF. (eds) Modern Advances in Applied Intelligence. IEA/AIE 2014. Lecture Notes in Computer Science(), vol 8481. Springer, Cham. https://doi.org/10.1007/978-3-319-07455-9_49
Download citation
DOI: https://doi.org/10.1007/978-3-319-07455-9_49
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-07454-2
Online ISBN: 978-3-319-07455-9
eBook Packages: Computer ScienceComputer Science (R0)