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Tactile Shoe Inlays for High Speed Pressure Monitoring

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Intelligent Robotics and Applications (ICIRA 2015)

Part of the book series: Lecture Notes in Computer Science ((LNAI,volume 9245))

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Abstract

This work describes the development of flexible tactile sensor shoe inlays for humanoid robots. Their design is based on a sandwich structure of flexible layers with a thin sheet of piezoresistive rubber as main transducer element. The layout and patterning of top and bottom electrodes give 1024 pressure sensitive cells and the use of high speed electronics and multiplexing algorithms provides frame rates of 100 Hz. The sensors tolerate overloads while showing a consistent output. The developed prototypes show a high potential not only for robotics, but also for use in sensorised human prosthetics.

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Author information

Authors and Affiliations

  1. Mads Clausen Institute, University of Southern Denmark, 6400, Sønderborg, Denmark

    Alin Drimus & Stefan Mátéfi-Tempfli

Authors
  1. Alin Drimus
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  2. Stefan Mátéfi-Tempfli
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Corresponding author

Correspondence to Alin Drimus .

Editor information

Editors and Affiliations

  1. University of Portsmouth, Portsmouth, United Kingdom

    Honghai Liu

  2. Tokyo Metropolitan University, Tokyo, Japan

    Naoyuki Kubota

  3. Shanghai Jiao Tong University, Shanghai, China

    Xiangyang Zhu

  4. Karlsruhe Institute of Technology, Karlsruhe, Germany

    Rüdiger Dillmann

  5. University of Portsmouth, Portsmouth, United Kingdom

    Dalin Zhou

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© 2015 Springer International Publishing Switzerland

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Drimus, A., Mátéfi-Tempfli, S. (2015). Tactile Shoe Inlays for High Speed Pressure Monitoring. In: Liu, H., Kubota, N., Zhu, X., Dillmann, R., Zhou, D. (eds) Intelligent Robotics and Applications. ICIRA 2015. Lecture Notes in Computer Science(), vol 9245. Springer, Cham. https://doi.org/10.1007/978-3-319-22876-1_7

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  • DOI: https://doi.org/10.1007/978-3-319-22876-1_7

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-22875-4

  • Online ISBN: 978-3-319-22876-1

  • eBook Packages: Computer ScienceComputer Science (R0)

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