Abstract
In this paper we explain detailed how we successfully decapsulated a state of the art FPGA realized in a 45 nm technology and packaged in a BGA housing. For running SCA attacks it is important that the IC is still fully functional after decapsulation. The challenge here is the BGA package since the acid used to remove the plastic can easily destroy the substrate that is under the die. We achieved a success rate of 100 %. The effect of the decapsulation for measuring EM traces is that the traces show an about 30 % higher amplitude.
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References
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Acknowledgments
The work presented in this paper has been partially funded by the “Ministry of Sciences, Research and Cultural Affairs (MWFK)” from resources of the European Social Fund (ESF) and of the state Brandenburg.
We thank Dipl.-Stom. Nikolai Kljagin for x-raying of the FPGA in his dental clinic.
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Wittke, C., Dyka, Z., Skibitzki, O., Langendoerfer, P. (2016). Preparation of SCA Attacks: Successfully Decapsulating BGA Packages. In: Bica, I., Reyhanitabar, R. (eds) Innovative Security Solutions for Information Technology and Communications. SECITC 2016. Lecture Notes in Computer Science(), vol 10006. Springer, Cham. https://doi.org/10.1007/978-3-319-47238-6_17
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DOI: https://doi.org/10.1007/978-3-319-47238-6_17
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