Abstract
The paper analyses the trend in packaging for low-power integrated circuits (IC) and the principal failures that can occur. A Fault-tree (FT) analysis is proposed, as well an analysis of the failure distribution (FD), which can be useful in safety-critical applications such as industrial and automotive.
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Saponara, S., Ciarpi, G., Fanucci, L. (2018). Failure Analysis of Plastic Packages for Low-Power ICs. In: De Gloria, A. (eds) Applications in Electronics Pervading Industry, Environment and Society. ApplePies 2016. Lecture Notes in Electrical Engineering, vol 429. Springer, Cham. https://doi.org/10.1007/978-3-319-55071-8_21
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DOI: https://doi.org/10.1007/978-3-319-55071-8_21
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Online ISBN: 978-3-319-55071-8
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