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Split-Gate Floating Poly SuperFlash® Memory Technology, Design, and Reliability

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Embedded Flash Memory for Embedded Systems: Technology, Design for Sub-systems, and Innovations

Part of the book series: Integrated Circuits and Systems ((ICIR))

Abstract

Split-gate embedded flash memory technology has been around for a couple of decades and has become a de facto standard for embedded products such as microcontrollers and smart cards. The majority of the large microcontroller and smartcard chip-makers and a series of fabless companies are now using some form of a split-gate embedded flash-memory technology because of its advantages in power, performance, and cost compared with traditional EEPROM or stacked-gate solutions. This chapter covers the fundamentals of split-gate embedded flash memories with an emphasis on SST’s widely adopted SuperFlash® memory technology as an example to demonstrate the benefits of a split-gate embedded flash-memory technologies. The fundamentals of SuperFlash technology, design, reliability, and scalability are discussed in detail in various sections, which would provide a detailed understanding of a split-gate, embedded flash-memory technology.

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Authors and Affiliations

  1. Microchip Technology Inc, Chandler, USA

    Nhan Do, Hieu Van Tran, Alex Kotov & Vipin Tiwari

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  1. Nhan Do
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  2. Hieu Van Tran
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  3. Alex Kotov
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  4. Vipin Tiwari
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Corresponding author

Correspondence to Vipin Tiwari .

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Editors and Affiliations

  1. Renesas Electronics Corporation, Tokyo, Japan

    Hideto Hidaka

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Do, N., Van Tran, H., Kotov, A., Tiwari, V. (2018). Split-Gate Floating Poly SuperFlash® Memory Technology, Design, and Reliability. In: Hidaka, H. (eds) Embedded Flash Memory for Embedded Systems: Technology, Design for Sub-systems, and Innovations. Integrated Circuits and Systems. Springer, Cham. https://doi.org/10.1007/978-3-319-55306-1_5

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  • DOI: https://doi.org/10.1007/978-3-319-55306-1_5

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-55305-4

  • Online ISBN: 978-3-319-55306-1

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