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Delay and Area Efficient Sound Wave Decomposition by Nonuniform Filter Bank for Digital Hearing Aids

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Proceedings of SAI Intelligent Systems Conference (IntelliSys) 2016 (IntelliSys 2016)

Part of the book series: Lecture Notes in Networks and Systems ((LNNS,volume 15))

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Abstract

Hearing aid devices generally amplify the sound signals selectively and then transfer the processed signal to the ear. Various fixed and reconfigurable filter banks are reported for different sound wave decomposition plans. The delay and complexity of the reported structures are relatively large for a real hearing aid system. In this paper, a constrained least square, finite impulse response filter bank with low group delay and low hardware complexity is proposed. The proposed method has considerable reduction in multiplications per sample and is more suitable for real time situations where the spectra of signals and noises are overlapped.

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Authors and Affiliations

  1. Division of Electronics Engineering, School of Engineering, Cochin University of Science and Technology, Kochi, India

    V. V. Mahesh & T. K. Shahana

Authors
  1. V. V. Mahesh
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  2. T. K. Shahana
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Correspondence to V. V. Mahesh .

Editor information

Editors and Affiliations

  1. Faculty of Computing and Engineering, School of Computing and Mathematics, University of Ulster at Jordanstown, Newtownabbey, United Kingdom

    Yaxin Bi

  2. The Science and Information (SAI) Organization, Bradford, West Yorkshire, United Kingdom

    Supriya Kapoor

  3. The Science and Information (SAI) Organization, Bradford, West Yorkshire, United Kingdom

    Rahul Bhatia

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Mahesh, V.V., Shahana, T.K. (2018). Delay and Area Efficient Sound Wave Decomposition by Nonuniform Filter Bank for Digital Hearing Aids. In: Bi, Y., Kapoor, S., Bhatia, R. (eds) Proceedings of SAI Intelligent Systems Conference (IntelliSys) 2016. IntelliSys 2016. Lecture Notes in Networks and Systems, vol 15. Springer, Cham. https://doi.org/10.1007/978-3-319-56994-9_5

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  • DOI: https://doi.org/10.1007/978-3-319-56994-9_5

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-56993-2

  • Online ISBN: 978-3-319-56994-9

  • eBook Packages: EngineeringEngineering (R0)

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