Abstract
This study reports the use of aluminum nitride(AlN) ceramics as a heat dissipated interface material to enhance the thermal performance of light-emitting diode (LED) packages. AlN ceramics are coated on copper/aluminum substrates by electrostatic spraying. The 18 orthogonal arrays of the LEDs with a signal-to-noise ratio are adopted and the impact of the effect of the spraying parameters on the AlN coatings is examined. Using an optimized design, the thermal performance of the LED is improved and good heat resistance characteristics are achieved. A confirmation run is used to compare results with the overall experimental tests. The results show that using AlN ceramic coating on a heat sink yields a good the thermal performance.
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References
Shanmugan, S., Mutharasu, D.A., Haslan, H.: A study on AlN thin film as thermal interface material for high power LED. Int. J. Electron. Comput. Sci. Eng. 2(1), 296–300 (2014)
Kuo, P.K.G., Auner, W., Wu, Z.L.: Microstructure and thermal conductivity of epitaxial AlN thin films. Thin Solid Films 253, 223–227 (1994)
Lee, J.W., Cuomo, J.J., Cho, Y.S., Keusseyan, R.L.: Aluminum nitride thin films on an LTCC substrate. J. Amer. Ceram. Soci 88(7), 1977–1980 (2005)
Park, S.H.: Robust Design and Analysis for Quality Engineering. Chapman & Hall, London (1996)
Pan, T.S., Zhang, Y., Huang, J., Zeng, B., Hong, D.H., Wang, S.L., Zeng, H.Z., Gao, M., Huang, W., Lin, Y.: Enhanced thermal conductivity of polycrystalline aluminum nitride thin films by optimizing the interface structure. J. Appl. Phys. 112 (2012)
Heo, Y.J., Kim, H.T., Kim, K.J., Nahm, S., Yoon, Y.J., Kim, J.H.: Enhanced heat transfer by room temperature deposition of AlN film on aluminum for a light emitting diode package. Appl. Therm. Eng. 50, 799–804 (2013)
Lu, X.Y., Hua, T.C., Wang, Y.P.: Thermal analysis of high power LED package with heat pipe heat sink. Microelectron. J. 42, 1257–1262 (2011)
Christensen, A., Graham, S.: Thermal effects in packaging high power light emitting diode arrays. Appl. Therm. Eng. 29, 364–371 (2009)
Yung, K.C., Liem, H., Choy, H.S., Lun, W.K.: Thermal performance of high brightness LED array package on PCB. Int. Commun. Heat Mass Transfer 37, 1266–1272 (2010)
Cheng, T., Luo, X.B., Huang, S., Liu, S.: Thermal analysis and optimization of multiple LED packaging based on a general solution. Int. J. Therm. Sci. 49, 196–201 (2010)
Kim, Y.P., Kim, Y.S., Ko, S.C.: Thermal characteristics and fabrication of silicon sub-mount based LED package. Microelectron. Reliab. 56, 53–60 (2016)
King, S.Y., Tseng, J., Zhao, J.: Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging. Appl. Therm. Eng. 52, 120–129 (2013)
Yang, K.S., Chung, C.H., Tu, C.W., Wong, C.C., Yang, T.Y., Lee, M.T.: Thermal spreading resistance characteristics of a high power lightemitting diode module. Appl. Therm. Eng. 70, 361–368 (2014)
Acknowledgments
This research was financially supported by the Natural Science Foundation of Fujian Province (grant number 2015J01181)
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Lian, GF., Jean, MD., Chien, TH. (2018). Application of AlN-Coated Heat Sink to Improve the Thermal Management of Light-Emitting Diode Assembles. In: Pan, JS., Tsai, PW., Watada, J., Jain, L. (eds) Advances in Intelligent Information Hiding and Multimedia Signal Processing. IIH-MSP 2017. Smart Innovation, Systems and Technologies, vol 82. Springer, Cham. https://doi.org/10.1007/978-3-319-63859-1_28
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DOI: https://doi.org/10.1007/978-3-319-63859-1_28
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