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High-Throughput Sockets over RDMA for the Intel Xeon Phi Coprocessor

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High Performance Computing (ISC High Performance 2017)

Part of the book series: Lecture Notes in Computer Science ((LNTCS,volume 10524))

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Abstract

In this paper we describe the design, implementation and performance of Trans4SCIF, a user-level socket-like transport library for the Intel Xeon Phi coprocessor. Trans4SCIF library is primarily intended for high-throughput applications. It uses RDMA transfers over the native SCIF support, in a way that is transparent for the application, which has the illusion of using conventional stream sockets. We also discuss the integration of Trans4SCIF with the ZeroMQ messaging library, used extensively by several applications running at CERN. We show that this can lead to a substantial, up to 3x, increase of application throughput compared to the default TCP/IP transport option.

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Acknowledgments

Many thanks for the great support we received from Kristina Gunne, Omar Awile and Luca Atzori from CERN openlab and the CERN IT department.

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Authors and Affiliations

  1. Maynooth University, Maynooth, Ireland

    Aram Santogidis

  2. CERN, Geneva, Switzerland

    Aram Santogidis

  3. University of Thessaly, Volos, Greece

    Spyros Lalis

Authors
  1. Aram Santogidis
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  2. Spyros Lalis
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Corresponding author

Correspondence to Aram Santogidis .

Editor information

Editors and Affiliations

  1. Deutsches Klimarechenzentrum (DKRZ), Hamburg, Hamburg, Germany

    Julian M. Kunkel

  2. TITECH, Tokyo, Japan

    Rio Yokota

  3. Department of Computer Science, University of Delaware, Newark, Delaware, USA

    Michela Taufer

  4. Lawrence Berkeley National Laboratory, Berkeley, California, USA

    John Shalf

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Santogidis, A., Lalis, S. (2017). High-Throughput Sockets over RDMA for the Intel Xeon Phi Coprocessor. In: Kunkel, J., Yokota, R., Taufer, M., Shalf, J. (eds) High Performance Computing. ISC High Performance 2017. Lecture Notes in Computer Science(), vol 10524. Springer, Cham. https://doi.org/10.1007/978-3-319-67630-2_6

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  • DOI: https://doi.org/10.1007/978-3-319-67630-2_6

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-67629-6

  • Online ISBN: 978-3-319-67630-2

  • eBook Packages: Computer ScienceComputer Science (R0)

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