Abstract
This paper presents the Customisable Modular Platform (CMP) approach. The aim is to accelerate FPGA application development by raising the level of abstraction and facilitating design reuse. The solution is based on network of Nodes, communicating using packet-based protocol. The approach is illustrated using SoftSONIC, a CMP for video applications. Our approach promotes modularity and design reuse by having multiple interoperable layers of design abstraction, while supporting advanced development and verification methods such as mixed-abstraction execution and efficient system-level simulation based on Transaction Level Modelling. The platform provides domain-specific abstractions and customisations of various elements such as communication protocols and topology, enabling exploitation of data locality and fine- and coarse-grain parallelism. The benefits of our approach is demonstrated using SoftSONIC for development of several real-time HDTV video processing applications.
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References
Lysaght, P.: FPGAs as meta-platforms for embedded systems. In: Proc. IEEE Int. Conf. on Field-Programmable Technology (2002)
Keutzer, K., Newton, A.R., Rabaey, J.M., Sangiovanni-Vincentelli, A.: Systemlevel design: orthogonalization of concerns and platform-based design. IEEE Trans. Computer-Aided Design of Integrated Circuits and Systems 19 (2000)
Ferrari, A., Sangiovanni-Vincentelli, A.: System design: traditional concepts and new paradigms. In: Proc. Int. Conf. on Computer Design: VLSI in Computer and Processors (1999)
Abdi, S., Shin, D., Gajski, D.D.: Automatic communication refinement for system level design. In: Proc. Design Automation Conference (2003)
Benini, L., Micheli, G.D.: Networks on chips: A new SoC paradigm. IEEE Computer (2002)
Grötker, T., Liao, S., Marting, G., Swan, S.: System Design with SystemC. Kluwer Academic Publishers, Dordrecht (2002)
Gajski, D.D., Zhu, J., Domer, R., Gerstlauer, A., Zhao, S.: SpecC: Specification Language and Methodology. Kluwer Academic Publishers, Dordrecht (2000)
Sedcole, P., Cheung, P.Y.K., Constantinides, G.A., Luk, W.: A reconfigurable platform for real-time embedded video image processing. In: Proc. Int. Conf. on Field-Programmable Logic and Applications (2003)
Semiconductor Industry Association: International Technology Roadmap for Semiconductors (1999, 2001, 2003)
Lysaght, P.: Future design tools for platform FPGAs. In: Proc. Symp. on Integrated Circuits and Systems Design (2003)
Tuan, T., Li, S., Rabaey, J.: Reconfigurable platform design for wireless protocol processors. In: International Conf. on Acoustics, Speech, and Signal Processing (2001)
Spivey, G., Bhattacharyya, S.S., Nakajima, K.: A component architecture for FPGA-based, DSP system design. In: IEEE Int. Conf. on Application-specific Systems, Architectures and Processors (2002)
Kogel, T., et al.: Virtual architecture mapping: A systemc based methodology for architectural exploration of system-on-chip designs. In: Proc. Int. Conf. on Systems, Architectures, Modeling, and Simulation (2003)
Haynes, S.D., Epsom, H.G., Cooper, R.J., McAlpine, P.L.: UltraSONIC: A reconfigurable architecture for video image processing. In: Proc. Int. Conf. on Field- Programmable Logic and Applications (2002)
Haynes, S.D., Stone, J., Cheung, P.Y.K., Luk, W.: Video image processing with the SONIC architecture. IEEE Computer 33 (2000)
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Rissa, T., Cheung, P.Y.K., Luk, W. (2004). SoftSONIC: A Customisable Modular Platform for Video Applications. In: Becker, J., Platzner, M., Vernalde, S. (eds) Field Programmable Logic and Application. FPL 2004. Lecture Notes in Computer Science, vol 3203. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-30117-2_8
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DOI: https://doi.org/10.1007/978-3-540-30117-2_8
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