Abstract
We are developing a minute tactile sensor having four cantilevers for sensing pressure and shear forces simultaneously and for distributing over a small area to recognize a certain area’s conditions. Toward our goal, another important task is to establish, in parallel with the sensor’s fabrication, a computing method that converts measured signals to applied forces. In this paper, we first investigate our sensing mechanism using a centimeter scale mockup of the actual sensor. Then, we formulate the relationship between the applied forces and the sensor outputs by a numerical analysis using a sufficient number of pairings of the forces and outputs. Finally, we examine the potential of the method.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Someya, T., et al.: A large-area, flexible pressure sensor matrix with organic field-effect transistors for artificial skin applications. PNAS 101(27), 9966–9970 (2004)
Sohgawa, M., et al.: Fabrication and Characterization of Silicon-Polymer Beam Structures for Cantilever-Type Tactile Sensors. In: Transducers 2007, pp. 1461–1464 (2007)
Yoshida, S., et al.: Development of an Integrated Multi-Axis Tactile Sensor: Distributed Preprocessing for Tactile Recognitions. In: IEEE VR 2007, pp. 281–282 (2007)
Nitta Corporation: I-SCAN (2008), http://www.nitta.co.jp/english/product/
Author information
Authors and Affiliations
Editor information
Rights and permissions
Copyright information
© 2008 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Yoshida, S., Miyazawa, T., Mizota, T., Higuchi, K., Kanashima, T., Noma, H. (2008). Development of a Microscopic Three-Axis Tactile Sensor: Preliminary Examinations to Establish Sensing Algorithm by Using a Simulated Mockup. In: Ferre, M. (eds) Haptics: Perception, Devices and Scenarios. EuroHaptics 2008. Lecture Notes in Computer Science, vol 5024. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-69057-3_72
Download citation
DOI: https://doi.org/10.1007/978-3-540-69057-3_72
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-69056-6
Online ISBN: 978-3-540-69057-3
eBook Packages: Computer ScienceComputer Science (R0)