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Minimizing Thermal Effects of In Vivo Body Sensors

  • Conference paper
4th International Workshop on Wearable and Implantable Body Sensor Networks (BSN 2007)

Part of the book series: IFMBE Proceedings ((IFMBE,volume 13))

Abstract

In sensor networks, energy availability is often viewed as a constraint in the long-term sustainability of the network. Duplicate message suppression and message aggregation are high-level layer approaches to reduce power consumption. Body sensor networks have similar constraints however the use of aggregator nodes may increase the heat dissipation in the tissue surrounding these nodes. Due to additional processing, this additional heat may raise the tissue temperature to a level damaging to the individual. We propose a model of data reporting that balances power consumption with body temperature thresholds. We present a generic algorithm along with implementation analysis via simulation.

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Author information

Authors and Affiliations

  1. College of Engineering, Virginia Polytechnic Institute and State University, Virginia, USA

    Daniel Garrison

Authors
  1. Daniel Garrison
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Editor information

Editors and Affiliations

  1. Helmholtz Institute of Biomedical Engineering, RWTH Aachen University, Pauwelstr. 20, 52074, Aachen, Germany

    Steffen Leonhardt (Chair of Medical Information Technology) (Chair of Medical Information Technology)

  2. Connectivity Systems Group, Philips Research Europe, Weisshausstr. 2, 52066, Aachen, Germany

    Thomas Falck

  3. RWTH Aachen University, Kackertstr. 9, 52072, Aachen, Germany

    Petri Mähönen (Chair of Wireless Networks) (Chair of Wireless Networks)

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© 2007 International Federation for Medical and Biological Engineering

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Garrison, D. (2007). Minimizing Thermal Effects of In Vivo Body Sensors. In: Leonhardt, S., Falck, T., Mähönen, P. (eds) 4th International Workshop on Wearable and Implantable Body Sensor Networks (BSN 2007). IFMBE Proceedings, vol 13. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-70994-7_47

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  • DOI: https://doi.org/10.1007/978-3-540-70994-7_47

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-70993-0

  • Online ISBN: 978-3-540-70994-7

  • eBook Packages: EngineeringEngineering (R0)

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