Abstract
Anisotropic conductive adhesives (ACAs) are a set of materials typically combining either epoxy or acryl adhesives and conductive particles to allow electrical connection across what would otherwise be a standard mechanical adhesive assembly. They differ from isotropic conductive adhesives such as silver epoxy in that the conductive particles are loaded and distributed in such a way that they do not conduct within the bulk of the adhesive, but do conduct in the Z-axis when they are trapped between electrodes on the top and bottom substrates. This allows them to offer some unique advantages compared with isotropic adhesives or various solder technologies. In the case of touch panels, these advantages are primarily related to its low temperature and high interconnect density capabilities, although cost and speed of assembly may also be considerations.
ACAs are widely used in the display and electronics assembly industries. In flat panel displays, they are used to make the connection between the drive circuitry and the display itself. They are also used extensively in other applications that require high-density and/or low-temperature assembly at high volume. This includes touch panels, camera modules for mobile phones, touchpads for notebook computers, and RFID assemblies for smartcards. ACAs have also had limited success in semiconductor packaging, but the reliability requirements for these applications are not always possible to achieve with ACA technology.
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Abbreviations
- ACA:
-
Anisotropic Conductive Adhesives
- ACF:
-
Anisotropic Conductive Film
- ACP:
-
Anisotropic Conductive Paste
- COB:
-
Chip-On-Board
- COF:
-
Chip-On-Flex
- COG:
-
Chip-On-Glass
- DSC:
-
Differential Scanning Calorimetry
- FOB:
-
Flex-On-Board
- FOF:
-
Flex-On-Flex
- FOG:
-
Flex-On-Glass
- FPC:
-
Flexible Printed Circuit
- FTIR:
-
Fourier Transform Infrared Spectroscopy
- PCB:
-
Printed Circuit Board
References
Savolainen P, Saarinen I, Rusanen O (2004) High-density interconnections in mobile phones using ACF. In: Polytronics 2004 IEEE international conference on polymers & adhesives, Portland, September 2004, AP22
Islam RA, Chan YC (2004) Effect of drop impact energy on contact resistance of anisotropic conductive film adhesive film joints. J Mater Res 19(6):1662–1668
Chen X, Zhang J, Jao C, Liu Y (2005) Bonding parameters of anisotropic conductive adhesive film and peeling strength. Key Eng Mater 297–300:918–923
Kim H-J, Chung C-K, Yim M-J, Hong S-M, Jang S-Y, Moon Y-J, Paik K-W (2006) Study on bubble formation in rigid-flexible substrates bonding using anisotropic conductive films (ACFs) and their effects on the ACF joint reliability. In: Proceedings of the 56th electronic components and technology conference, 2006, San Diego
Further Reading
Anisotropic Conductive Film. http://www.sonycid.jp/en/products/dd1/index.html
Anisolm. http://www.hitachi-chem.co.jp/japanese/products/do/001.html
A list of high-quality papers on ACF that are available online is maintained at http://autoacf.com/ACF_Online_Resources.aspx
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© 2012 Springer-Verlag Berlin Heidelberg
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Opdahl, P.J. (2012). Anisotropic Conductive Adhesives. In: Chen, J., Cranton, W., Fihn, M. (eds) Handbook of Visual Display Technology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-79567-4_65
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DOI: https://doi.org/10.1007/978-3-540-79567-4_65
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-79566-7
Online ISBN: 978-3-540-79567-4
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