Skip to main content

Combined Scheduling Criteria Approach for Semiconductor Wafer Fabrication System Based on Fuzzy Cognitive Maps

  • Conference paper
Fuzzy Information and Engineering Volume 2

Part of the book series: Advances in Intelligent and Soft Computing ((AINSC,volume 62))

  • 1349 Accesses

Abstract

To the majority of existing studies of semiconductor wafer fabrication system scheduling, simple scheduling rule is not capable to realize the multi-objective optimization. Usually combined scheduling criteria may be paid diverse emphases which are represented by weights. This paper proposed a successful application of fuzzy cognitive map concept on the scheduling of wafer fabrication system scheduling. The first step is to define the common scheduling rules which represent the single optimization objectives and then develop the approach of combined scheduling rules to determine the weight values of different rules in which the fuzzy cognitive map approach is applied to offer the solution effectively considering the goal of combined scheduling criteria. Be compared with the simple scheduling rule by a case study, the proposed approach is certified as a practical and useful way to realize the real-time scheduling optimization.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Subscribe and save

Springer+ Basic
$34.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or eBook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Similar content being viewed by others

References

  1. Hui-ran, L., Fung, R.Y.K., Zhi-bin, J.: Modeling of semiconductor wafer fabrication systems by extended object-oriented petri nets. International Journal of Production Research 43(3), 471–495 (2005)

    Article  Google Scholar 

  2. Uzsoy, R., Lee, C.Y., Martin-vega, L.A.: A review of production planning and scheduling models in the semiconductor industry. IIE Transaction on Shop-floor control 26, 44–55 (1994)

    Google Scholar 

  3. Chou, Y.C., Hong, I.H.: A Methodology for Product Mix Planning in Semiconductor Foundry Manufacturing. IEEE Transaction on Semiconductor Manufacturing 13, 278–285 (2000)

    Article  Google Scholar 

  4. Chung, S.H., Pearn, W.L., Lee, A.H.I., Ke, T.E.: Job order releasing and throughput planning for multi-priority orders in wafer fabs. International Journal of Production Research 41(8), 1765–1784 (2003)

    Article  MATH  Google Scholar 

  5. Wang, Z., Qiao, F., Wu, Q.: Semiconductor Wafer Fabrication with Optimization of Multiple objectives Scheduling. In: Proceeding of IEEE International Automation Science. Engineering, pp. 253–258 (2006)

    Google Scholar 

  6. Sivakuma, A.I.: Optimization of cycle time and utilization in semiconductor test manufacturing using simulation-based, online near real-time scheduling system. In: Winter Simulation Conference, pp. 727–735 (1999)

    Google Scholar 

  7. Tyan, J.C., Chen, C.C., Wang, F.K.: Development of a state-dependent dispatch rule using theory of constraints in near-real-world wafer fabrication. Production Planning and Control 13(2), 253–261 (2002)

    Google Scholar 

  8. Dabbas, R.M., Fowler, J.W.: A new scheduling approach using combined dispatching criteria in wafer fabs. IEEE Transaction on Semiconductor Manufacturing 16, 501–510 (2003)

    Article  Google Scholar 

  9. Persson, A., Grimm, H., Ng, A., Lezama, T., Ekberg, J., Falk, S., Stablum, P.: Simulation-based multi-objective optimization of a real-world scheduling problem. In: Winter Simulation Conference, pp. 1757–1764 (2006)

    Google Scholar 

  10. Kickerson, J.A., Kosko, B.: Virtual Worlds as Fuzzy Cognitive Maps. Presence (1994)

    Google Scholar 

  11. Xirogiannis, G., Stefanoua, J., Glykasb, M.: A fuzzy cognitive map approach to support urban design. Expert Systems with Applications 26, 257–268 (2004)

    Article  Google Scholar 

  12. Stylios, C.D., Groumpos, P.P.: Modeling complex systems using fuzzy cognitive maps. IEEE transactions on Systems, Man, and Cybernetics—Part a: Systems and Humans 34(1), 155–162 (2004)

    Article  Google Scholar 

  13. Wu, X., Cai, K.: Knowledge object modeling. IEEE Transactions on Systems, Man, and Cybernetics—Part a: Systems and Humans 30, 96–107 (2000)

    Article  Google Scholar 

  14. Tianfield, H.: Formalized analysis of structural characteristics of large complex systems. IEEE Transactions on Systems, Man, and Cybernetics—Part a: Systems and Humans 31, 559–572 (2001)

    Article  Google Scholar 

  15. Lee, S., Kim, B.G., Lee, K.: Fuzzy cognitive map-based approach to evaluate EDI performance: a test of causal model. Expert Systems with Applications 27, 287–299 (2004)

    Article  Google Scholar 

  16. Miao, Y., Liu, Z.-Q., Siew, C.K., Miao, C.Y.: Dynamical cognitive network - an extension of fuzzy cognitive map. IEEE Transactions on Fuzzy Systems 9(5), 760–770 (2001)

    Google Scholar 

  17. Liu, H.: Research on modeling and real-time dispatching for semiconductor wafer fabrication system upon the extended object-oriented petri nets, PhD dissertation, Shanghai Jiao Tong University (2007)

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2009 Springer-Verlag Berlin Heidelberg

About this paper

Cite this paper

Liang, F. (2009). Combined Scheduling Criteria Approach for Semiconductor Wafer Fabrication System Based on Fuzzy Cognitive Maps. In: Cao, B., Li, TF., Zhang, CY. (eds) Fuzzy Information and Engineering Volume 2. Advances in Intelligent and Soft Computing, vol 62. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-03664-4_141

Download citation

  • DOI: https://doi.org/10.1007/978-3-642-03664-4_141

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-03663-7

  • Online ISBN: 978-3-642-03664-4

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics