Abstract
Manufacturers and distributors alike are seeking better ways to more efficiently manage the assets of their operators. Advances in communication technologies and standards are now making them easier and more cost justifiable to deliver information from measurement instrumentation as well as manage these instrumentation assets more efficiently. Today’s technologies such as Electronic Device Description Language (EDDL) and Field Device Tool (FDT) are available for device integration. This paper introduces a flexible device integration approach to achieving the advantages of both such technologies for the device management to new OPC Unified Architecture (UA)-based process automation systems. This approach is suitable not only for the process automation industry, but also for the factory automation industry. Visibility of and access to field device information through the OPC standards, FDT, and EDDL contribute to efforts to improve the life cycle management of process plants and associated distribution operations.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Bohn, H., Bobek, A., Golatowski, F.: SIRENA – Service Infrastructure for Real-time Embedded Networked Devices: A Service Oriented Framework for Different Domains. In: Proceedings of the Int. Conf. on Systems and Int. Conf. on Mobile Communications and Learning Technologies, p. 43. IEEE CS Press, Los Alamitos (2006)
Braune, A., Hennig, S., Hegler, S.: Evaluation of OPC UA Secure Communication in Web browser Applications. In: Proceedings of the IEEE Int. Conf. on Industrial Informatics, pp. 1660–1665 (2008)
de Souza, L.M.S., Spiess, P., Guinard, D., Köhler, M., Karnouskos, S., Savio, D.: SOCRADES: A web service based shop floor integration infrastructure. In: Floerkemeier, C., Langheinrich, M., Fleisch, E., Mattern, F., Sarma, S.E. (eds.) IOT 2008. LNCS, vol. 4952, pp. 50–67. Springer, Heidelberg (2008)
Dzung, D., Naedele, M., Hoff, T.P.V., Crevatin, M.: Security for Industrial Communication Systems. Proceedings of IEEE 93(6), 1152–1177 (2005)
EDDL - Electronic Device Description Language, http://www.eddl.org/
FDT-JIG Working Group: FDT Interface Specification, version 1.2.1. FDT Joint Interest Group (2005), http://www.fdtgroup.org/
Grossmann, D., Bender, K., Danzer, B.: OPC UA based Field Device Integration. In: Proceedings of the SICE Annual Conference, pp. 933–938 (2008)
Hadlich, T.: Providing Device Integration with OPC UA. In: Proceedings of the 2006 IEEE Int. Conf. on Industrial Informatics, pp. 263–268. IEEE Press, Los Alamitos (2006)
Ivantysynova, L., Ziekow, H.: RFID in Manufacturing – From Shop Floor to Top Floor. In: Günther, O.P., Kletti, W., Kubach, U. (eds.) RFID in Manufacturing, pp. 1–24. Springer, Heidelberg (2008)
Jammes, F., Mensch, A., Smit, H.: Service-Oriented Device Communications using the Devices Profile for Web Services. In: Proceedings of the 3rd Int. Workshop on Middleware for Pervasive and Ad-Hoc Computing, pp. 1–8. ACM Press, New York (2005)
Karnouskos, S., Baecker, O., de Souza, L.M.S., Spiess, P.: Integration of SOA-ready Networked Embedded Devices in Enterprise Systems via a Cross-Layered Web Service Infrastructure. In: Proceedings of the 12th IEEE Int. Conf. on Emerging Technologies and Factory Automation, pp. 1–8. IEEE Press, Los Alamitos (2007)
Kastner, W., Kastner-Masilko, F.: EDDL inside FDT/DTM. In: Proceedings of the 2004 IEEE Int. Workshop on Factory Communication Systems, pp. 365–368. IEEE Press, Los Alamitos (2004)
Neumann, P., Simon, R., Diedrich, C., Riedl, M.: Field Device Integration. In: Proceedings of the 8th IEEE Int. Conf. on Emerging Technologies and Factory Automation, vol. 2, pp. 63–68. IEEE Press, Los Alamitos (2001)
Simon, R., Riedl, M., Diedrich, C.: Integration of Field Devices using Field Device Tool (FDT) on the basis of Electronic Device Descriptions (EDD). In: Proceedings of the 2003 IEEE Int. Symp. on Industrial Electronics, vol. 1, pp. 189–194. IEEE Press, Los Alamitos (2003)
Tetsuo, T.: FDT/DTM Framework for new Field Device Tools. Yokogawa Technical Report, no. 44, pp. 13–16 (2007), http://www.yokogawa.com/rd/pdf/TR/rd-tr-r00044-004.pdf
The OPC Foundation (2008) The OPC Unified Architecture Specification: Parts 1-11. Version 1.xx (2008), http://www.opcfoundation.org/Downloads.aspx
Tom, H., Mikko, S., Seppo, K.: Roadmap to Adopting OPC UA. In: Proceedings of the IEEE Int. Conf. on Industrial Informatics, pp. 756–761 (2008)
Yamamoto, M., Sakamoto, H.: FDT/DTM Framework for Field Device Integration. In: Proceedings of the SICE Annual Conference, pp. 925–928 (2008)
Zeeb, E., Bobek, A., Bohn, H., Golatowski, F.: Service-Oriented Architectures for Embedded Systems Using Devices Profile for Web Services. In: Proceedings of the 21st Int. Conf. on Advanced Information Networking and Applications Workshops, pp. 956–963. IEEE Press, Los Alamitos (2007)
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2009 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Van Tan, V., Yoo, DS., Yi, MJ. (2009). Device Integration Approach to OPC UA-Based Process Automation Systems with FDT/DTM and EDDL. In: Huang, DS., Jo, KH., Lee, HH., Kang, HJ., Bevilacqua, V. (eds) Emerging Intelligent Computing Technology and Applications. With Aspects of Artificial Intelligence. ICIC 2009. Lecture Notes in Computer Science(), vol 5755. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-04020-7_108
Download citation
DOI: https://doi.org/10.1007/978-3-642-04020-7_108
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-04019-1
Online ISBN: 978-3-642-04020-7
eBook Packages: Computer ScienceComputer Science (R0)