Skip to main content

Device Integration Approach to OPC UA-Based Process Automation Systems with FDT/DTM and EDDL

  • Conference paper
Emerging Intelligent Computing Technology and Applications. With Aspects of Artificial Intelligence (ICIC 2009)

Part of the book series: Lecture Notes in Computer Science ((LNAI,volume 5755))

Included in the following conference series:

Abstract

Manufacturers and distributors alike are seeking better ways to more efficiently manage the assets of their operators. Advances in communication technologies and standards are now making them easier and more cost justifiable to deliver information from measurement instrumentation as well as manage these instrumentation assets more efficiently. Today’s technologies such as Electronic Device Description Language (EDDL) and Field Device Tool (FDT) are available for device integration. This paper introduces a flexible device integration approach to achieving the advantages of both such technologies for the device management to new OPC Unified Architecture (UA)-based process automation systems. This approach is suitable not only for the process automation industry, but also for the factory automation industry. Visibility of and access to field device information through the OPC standards, FDT, and EDDL contribute to efforts to improve the life cycle management of process plants and associated distribution operations.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 129.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. Bohn, H., Bobek, A., Golatowski, F.: SIRENA – Service Infrastructure for Real-time Embedded Networked Devices: A Service Oriented Framework for Different Domains. In: Proceedings of the Int. Conf. on Systems and Int. Conf. on Mobile Communications and Learning Technologies, p. 43. IEEE CS Press, Los Alamitos (2006)

    Google Scholar 

  2. Braune, A., Hennig, S., Hegler, S.: Evaluation of OPC UA Secure Communication in Web browser Applications. In: Proceedings of the IEEE Int. Conf. on Industrial Informatics, pp. 1660–1665 (2008)

    Google Scholar 

  3. de Souza, L.M.S., Spiess, P., Guinard, D., Köhler, M., Karnouskos, S., Savio, D.: SOCRADES: A web service based shop floor integration infrastructure. In: Floerkemeier, C., Langheinrich, M., Fleisch, E., Mattern, F., Sarma, S.E. (eds.) IOT 2008. LNCS, vol. 4952, pp. 50–67. Springer, Heidelberg (2008)

    Chapter  Google Scholar 

  4. Dzung, D., Naedele, M., Hoff, T.P.V., Crevatin, M.: Security for Industrial Communication Systems. Proceedings of IEEE 93(6), 1152–1177 (2005)

    Article  Google Scholar 

  5. EDDL - Electronic Device Description Language, http://www.eddl.org/

  6. FDT-JIG Working Group: FDT Interface Specification, version 1.2.1. FDT Joint Interest Group (2005), http://www.fdtgroup.org/

  7. Grossmann, D., Bender, K., Danzer, B.: OPC UA based Field Device Integration. In: Proceedings of the SICE Annual Conference, pp. 933–938 (2008)

    Google Scholar 

  8. Hadlich, T.: Providing Device Integration with OPC UA. In: Proceedings of the 2006 IEEE Int. Conf. on Industrial Informatics, pp. 263–268. IEEE Press, Los Alamitos (2006)

    Chapter  Google Scholar 

  9. Ivantysynova, L., Ziekow, H.: RFID in Manufacturing – From Shop Floor to Top Floor. In: Günther, O.P., Kletti, W., Kubach, U. (eds.) RFID in Manufacturing, pp. 1–24. Springer, Heidelberg (2008)

    Chapter  Google Scholar 

  10. Jammes, F., Mensch, A., Smit, H.: Service-Oriented Device Communications using the Devices Profile for Web Services. In: Proceedings of the 3rd Int. Workshop on Middleware for Pervasive and Ad-Hoc Computing, pp. 1–8. ACM Press, New York (2005)

    Chapter  Google Scholar 

  11. Karnouskos, S., Baecker, O., de Souza, L.M.S., Spiess, P.: Integration of SOA-ready Networked Embedded Devices in Enterprise Systems via a Cross-Layered Web Service Infrastructure. In: Proceedings of the 12th IEEE Int. Conf. on Emerging Technologies and Factory Automation, pp. 1–8. IEEE Press, Los Alamitos (2007)

    Google Scholar 

  12. Kastner, W., Kastner-Masilko, F.: EDDL inside FDT/DTM. In: Proceedings of the 2004 IEEE Int. Workshop on Factory Communication Systems, pp. 365–368. IEEE Press, Los Alamitos (2004)

    Chapter  Google Scholar 

  13. Neumann, P., Simon, R., Diedrich, C., Riedl, M.: Field Device Integration. In: Proceedings of the 8th IEEE Int. Conf. on Emerging Technologies and Factory Automation, vol. 2, pp. 63–68. IEEE Press, Los Alamitos (2001)

    Google Scholar 

  14. Simon, R., Riedl, M., Diedrich, C.: Integration of Field Devices using Field Device Tool (FDT) on the basis of Electronic Device Descriptions (EDD). In: Proceedings of the 2003 IEEE Int. Symp. on Industrial Electronics, vol. 1, pp. 189–194. IEEE Press, Los Alamitos (2003)

    Google Scholar 

  15. Tetsuo, T.: FDT/DTM Framework for new Field Device Tools. Yokogawa Technical Report, no. 44, pp. 13–16 (2007), http://www.yokogawa.com/rd/pdf/TR/rd-tr-r00044-004.pdf

  16. The OPC Foundation (2008) The OPC Unified Architecture Specification: Parts 1-11. Version 1.xx (2008), http://www.opcfoundation.org/Downloads.aspx

  17. Tom, H., Mikko, S., Seppo, K.: Roadmap to Adopting OPC UA. In: Proceedings of the IEEE Int. Conf. on Industrial Informatics, pp. 756–761 (2008)

    Google Scholar 

  18. Yamamoto, M., Sakamoto, H.: FDT/DTM Framework for Field Device Integration. In: Proceedings of the SICE Annual Conference, pp. 925–928 (2008)

    Google Scholar 

  19. Zeeb, E., Bobek, A., Bohn, H., Golatowski, F.: Service-Oriented Architectures for Embedded Systems Using Devices Profile for Web Services. In: Proceedings of the 21st Int. Conf. on Advanced Information Networking and Applications Workshops, pp. 956–963. IEEE Press, Los Alamitos (2007)

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2009 Springer-Verlag Berlin Heidelberg

About this paper

Cite this paper

Van Tan, V., Yoo, DS., Yi, MJ. (2009). Device Integration Approach to OPC UA-Based Process Automation Systems with FDT/DTM and EDDL. In: Huang, DS., Jo, KH., Lee, HH., Kang, HJ., Bevilacqua, V. (eds) Emerging Intelligent Computing Technology and Applications. With Aspects of Artificial Intelligence. ICIC 2009. Lecture Notes in Computer Science(), vol 5755. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-04020-7_108

Download citation

  • DOI: https://doi.org/10.1007/978-3-642-04020-7_108

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-04019-1

  • Online ISBN: 978-3-642-04020-7

  • eBook Packages: Computer ScienceComputer Science (R0)

Publish with us

Policies and ethics